Patents by Inventor Hyeon Woo Son

Hyeon Woo Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096888
    Abstract: A super-steep switching device and an inverter device using the same are disclosed. The super-steep switching device includes a semiconductor channel disposed on a substrate and made of a semiconductor material having impact ionization characteristic; a source electrode and a drain electrode in contact with the semiconductor channel, wherein the source electrode and the drain electrode are disposed on the substrate and are spaced apart from each other; and a gate electrode disposed on the semiconductor channel so as to overlap only a portion of the semiconductor channel, wherein a top surface of the semiconductor channel includes a first area overlapping the gate electrode, and a second area non-overlapping the gate electrode, wherein a ratio of a length of the first area and a length of the second area is in a range of 1:0.1 to 0.4.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 21, 2024
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hae Ju CHOI, Tae Ho KANG, Chan Woo KANG, Hyeon Je SON, Jin Hong PARK, Sung Joo LEE, Sung Pyo BAEK
  • Publication number: 20210017435
    Abstract: The present disclosure relates to a novel high-performance latent heat storage composite manufactured by forming a network of protective nanostructures on the surface of a metal material having high thermal conductivity. Through a low volume content of a network having high thermal conductivity, high-density heat capacity may be secured. In addition, through use of a metal-based material having high thermal conductivity, thermal conductivity may be increased by about 7 times compared to a conventional pure phase change material.
    Type: Application
    Filed: July 17, 2020
    Publication date: January 21, 2021
    Applicant: Industry-University Cooperation Foundation Hanyang University
    Inventors: Dong Rip KIM, Hyeon Woo Son, Su Ho Kim, Chang Sung Heu, Heung Soo Lee
  • Publication number: 20210018275
    Abstract: The present disclosure relates to a phase change composite and a heat spreader including the same, and more particularly, to a phase change composite having improved cooling performance by being formed in a layer-by-layer structure composed of a material having high thermal conductivity and a phase change material. According to the present disclosure, by repeatedly laminating thermal conductive layers and phase change material unit layers, thermal conductivity in the horizontal direction may be dramatically improved. In addition, due to a high volume percentage of a phase change material, a heat spreader with a large heat capacity may be provided.
    Type: Application
    Filed: July 17, 2020
    Publication date: January 21, 2021
    Applicant: Industry-University Cooperation Foundation Hanyang University
    Inventors: Dong Rip KIM, Chang Sung HEU, Su Ho KIM, Heung Soo LEE, Hyeon Woo SON