Patents by Inventor Hyeong Chul Youn

Hyeong Chul Youn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof
    Patent number: 9136455
    Abstract: A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: September 15, 2015
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Su Jeong Suh, Hwa Sun Park, Hyeong Chul Youn
  • SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE SUBSTRATE, AND MANUFACTURING METHOD THEREOF
    Publication number: 20150179908
    Abstract: A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.
    Type: Application
    Filed: March 4, 2015
    Publication date: June 25, 2015
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: Su Jeong SUH, Hwa Sun PARK, Hyeong Chul YOUN
  • Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof
    Patent number: 9000593
    Abstract: A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: April 7, 2015
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Su Jeong Suh, Hwa Sun Park, Hyeong Chul Youn
  • SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE SUBSTRATE, AND MANUFACTURING METHOD THEREOF
    Publication number: 20130037955
    Abstract: A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.
    Type: Application
    Filed: August 7, 2012
    Publication date: February 14, 2013
    Inventors: Su Jeong SUH, Hwa Sun Park, Hyeong Chul Youn