Abstract: A heat exchanger is disclosed. Different cooling media are circulated in respective independent flow channels between the first heat-exchanging plate and the second heat-exchanging plate so as to perform heat exchange while preventing mixing between the different cooling media. A first guide of the first heat-exchanging plate and a second guide of the second heat-exchanging plate are layered to form an overlapping structure, and thus coupling capability and durability are improved when the first heat-exchanging plate and the second heat-exchanging plate are welded to each other. A discharge path is provided in order to detect internal leakage after welding between the first heat-exchanging plate and the second heat-exchanging plate, thereby making it possible to determine that there is malfunction in the heat exchanger based on the cooling media exposed from the discharge path when the cooling media leaks due to an internal defect.

Abstract: A heat exchanger is disclosed. A first heat-exchanging plate, in which plural kinds of cooling water are circulated, and a second heat-exchanging plate, in which refrigerant is circulated, have respective independent flow channels to prevent mixing between the cooling water and the refrigerant. The first and second heat-exchanging plates have respective guides, which are layered so as to form an overlapping structure, thereby improving coupling capability and durability when the first and second heat-exchanging plates are welded to each other in the state of being layered.

Abstract: A method of manufacturing a semiconductor package includes providing a substrate main body to which external connection terminals are attached, attaching a protective member to the substrate main body to cover the external connection terminals, mounting a semiconductor chip on a surface of the substrate main body that is opposite from the protective member, and removing the protective member from the substrate main body.

Abstract: A method of manufacturing a semiconductor package includes providing a substrate main body to which external connection terminals are attached, attaching a protective member to the substrate main body to cover the external connection terminals, mounting a semiconductor chip on a surface of the substrate main body that is opposite from the protective member, and removing the protective member from the substrate main body.