Abstract: A positive electrode for a lithium secondary battery includes a positive electrode collector, a first positive electrode active material layer formed on the positive electrode collector and includes a first positive electrode active material, and a second positive electrode active material layer formed on the first positive electrode active material layer and includes a second positive electrode active material. The first positive electrode active material and the second positive electrode active material include a lithium nickel-cobalt-based oxide in which an amount of nickel among total metallic components excluding lithium is 80 atm % or more, the first positive electrode active material has a molar ratio of nickel to cobalt of 18 or more, and the second positive electrode active material has a molar ratio of nickel to cobalt of less than 18.

Abstract: A positive electrode active material for a lithium secondary battery comprising lithium transition metal oxide particles having a core-shell structure which includes a core portion and a shell portion disposed on a surface of the core portion. Wherein, the average crystallite size of the core portion is smaller than an average crystallite size of the shell portion and an amount of nickel among total transition metals included in the core portion and the shell portion is 80 atm % or more. A positive electrode active material, which suppresses decomposition of an electrolyte solution and occurrence of micro cracks of the positive electrode active material during charge and discharge by forming an average crystallite size of a core portion of the high-nickel positive electrode active material smaller than an average crystallite size of a shell portion, and a method of preparing the same.

Abstract: An integrated circuit package and method of manufacture is provided. A substrate having a number of contact pads exposed through a passivation layer thereon has a first under bump metallurgy layer over at least one of the contact pads. A top under bump metallurgy layer of copper having a thickness of less than about 800 angstroms is formed over the first under bump metallurgy layer.

Abstract: An integrated circuit package is provided with a connective structure having a wire bonding zone and a keep-out zone. An integrated circuit die has an undercut defining an undercut zone, which is overlapped by the keep-out zone. A wire is bonded between the integrated circuit die and the connective structure within the wire bonding zone and outside of the keep-out zone.