Patents by Inventor Hyeong Hur

Hyeong Hur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Under bump metallurgy in integrated circuits
    Publication number: 20060160267
    Abstract: An integrated circuit package and method of manufacture is provided. A substrate having a number of contact pads exposed through a passivation layer thereon has a first under bump metallurgy layer over at least one of the contact pads. A top under bump metallurgy layer of copper having a thickness of less than about 800 angstroms is formed over the first under bump metallurgy layer.
    Type: Application
    Filed: January 14, 2005
    Publication date: July 20, 2006
    Applicant: STATS ChipPAC Ltd.
    Inventors: Hyeong Hur, Yew Yuen, See Lim, Puay Chua, Kah Gan, Jae-Yong Song, Yonggang Jin, Kyaw Aung
  • Integrated circuit package with keep-out zone overlapping undercut zone
    Publication number: 20050194698
    Abstract: An integrated circuit package is provided with a connective structure having a wire bonding zone and a keep-out zone. An integrated circuit die has an undercut defining an undercut zone, which is overlapped by the keep-out zone. A wire is bonded between the integrated circuit die and the connective structure within the wire bonding zone and outside of the keep-out zone.
    Type: Application
    Filed: March 3, 2004
    Publication date: September 8, 2005
    Applicant: ST Assembly Test Service Ltd.
    Inventors: Il Kwon Shim, Virgil Ararao, Hyeong Hur, Byung Han