Patents by Inventor Hyeong Il Jeon
Hyeong Il Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120262Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Publication number: 20240096766Abstract: In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 17, 2022Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Byong Jin KIM, Gi Jeong KIM
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Publication number: 20240096725Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 18, 2023Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dae Young PARK, Byong Jin KIM, Gi Jeong KIM, Hyeong Il JEON, Kwang Soo SANG, Jin Young KHIM
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Patent number: 11887916Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.Type: GrantFiled: September 9, 2020Date of Patent: January 30, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee
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Publication number: 20230178459Abstract: In one example, a packaged electronic device includes a molded substrate. The molded substrate includes a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side opposite to the edge lead outward side, and an inner lead having an inner lead outward side and an inner lead inward side opposite to the inner lead outward side. The molded substrate includes a substrate encapsulant covering a lower portion of the edge lead inward side, a lower portion of the inner lead inward side, and a lower portion of the inner lead outward side. An upper portion of the edge lead outward side and an upper portion of the inner lead outward side are exposed from the substrate encapsulant. An electronic component is connected to the edge lead and the inner lead. A body encapsulant covers the electronic component and portions of the conductive structure.Type: ApplicationFiled: December 7, 2021Publication date: June 8, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gi Jeong KIM, Hyeong Il JEON, Byong Jin KIM, Junichiro ABE
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Publication number: 20220077031Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.Type: ApplicationFiled: September 9, 2020Publication date: March 10, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Patent number: 10366943Abstract: An electronic package includes a substrate having a conductive element. The conductive element includes a stepped portion disposed at an end of the conductive element. In one embodiment, the conductive element is a lead. In another embodiment, the conductive element is a die pad. The stepped portion includes a first groove extending inward from a lower surface of the first conductive element, and a second groove extending further inward from the first groove towards an upper surface of the conductive element. An electronic component is connected to the conductive element. In one embodiment, a clip is used to electrically connect the electronic component to the conductive element. An encapsulant encapsulates the electronic component and a portion of the substrate such that the stepped portion is exposed outside an exterior side surface of the encapsulant. The stepped portion is configured to improve the bonding strength of the electronic package when attached to a next level of assembly.Type: GrantFiled: September 16, 2017Date of Patent: July 30, 2019Assignee: Amkor Technology, Inc.Inventors: Byong Jin Kim, Jia Yunn Ting, Hyeong Il Jeon
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Publication number: 20190088574Abstract: An electronic package includes a substrate having a conductive element. The conductive element includes a stepped portion disposed at an end of the conductive element. In one embodiment, the conductive element is a lead. In another embodiment, the conductive element is a die pad. The stepped portion includes a first groove extending inward from a lower surface of the first conductive element, and a second groove extending further inward from the first groove towards an upper surface of the conductive element. An electronic component is connected to the conductive element. In one embodiment, a clip is used to electrically connect the electronic component to the conductive element. An encapsulant encapsulates the electronic component and a portion of the substrate such that the stepped portion is exposed outside an exterior side surface of the encapsulant. The stepped portion is configured to improve the bonding strength of the electronic package when attached to a next level of assembly.Type: ApplicationFiled: September 16, 2017Publication date: March 21, 2019Applicant: Amkor Technology, Inc.Inventors: Byong Jin KIM, Jia Yunn TING, Hyeong Il JEON
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Patent number: 9673122Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.Type: GrantFiled: August 29, 2015Date of Patent: June 6, 2017Assignee: Amkor Technology, Inc.Inventors: Hyeong Il Jeon, Hyung Kook Chung, Hong Bae Kim, Byong Jin Kim
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Publication number: 20150371933Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.Type: ApplicationFiled: August 29, 2015Publication date: December 24, 2015Applicant: AMKOR TECHNOLOGY, INC.Inventors: Hyeong Il Jeon, Hyung Kook Chung, Hong Bae Kim, Byong Jin Kim
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Patent number: 9184118Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.Type: GrantFiled: May 2, 2014Date of Patent: November 10, 2015Assignee: Amkor Technology Inc.Inventors: Hyeong Il Jeon, Hyung Kook Chung, Hong Bae Kim, Byong Jin Kim
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Publication number: 20140327122Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.Type: ApplicationFiled: May 2, 2014Publication date: November 6, 2014Applicant: Amkor Technology, Inc.Inventors: Hyeong Il Jeon, Hyung Kook Chung, Hong Bae Kim, Byong Jin Kim