Patents by Inventor Hyeong Jin LEE

Hyeong Jin LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11882018
    Abstract: An apparatus for analyzing a network according to an embodiment includes a receiving module configured to receive, from a cloud service, information on one or more resources included in the cloud service and information on a network environment of the one or more resources, a topology generation module configured to derive a network topology of the cloud service by using the information on the resources and the information on the network environment, and an analysis module configured to derive, from the network topology, a communication possible path of each of the one or more resources and one or more communication allow policies in the communication possible path.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: January 23, 2024
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Jung Do Cha, Jung Hyun Ahn, Hyeong Jin Lee
  • Patent number: 11326786
    Abstract: An air conditioner comprises a compressor configured to have an inlet, through which a refrigerant is sucked in, the sucked refrigerant being compressed by the compressor, and an outlet, through which the compressed refrigerant is discharged, a four-way valve configured to switch flow paths in cooling and heating operations, the four-way valve having a valve body, a D port protruding from the valve body in a first direction to be connected to the outlet, and an S port 26 protruding from the valve body in a second direction, which is opposite to the first direction, to be connected to the inlet, and a compressor pipe having a discharging pipe to connect the outlet and the D port and a sucking pipe to connect the inlet and the S port, one of the discharging pipe and the sucking pipe has two curved portions and the other has one curved portion.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: May 10, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mun Sub Kim, Hyeong Joon Seo, Hyeong Jin Lee, Du Han Jung
  • Publication number: 20220141122
    Abstract: An apparatus for analyzing a network according to an embodiment includes a receiving module configured to receive, from a cloud service, information on one or more resources included in the cloud service and information on a network environment of the one or more resources, a topology generation module configured to derive a network topology of the cloud service by using the information on the resources and the information on the network environment, and an analysis module configured to derive, from the network topology, a communication possible path of each of the one or more resources and one or more communication allow policies in the communication possible path.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 5, 2022
    Inventors: Jung Do CHA, Jung Hyun AHN, Hyeong Jin LEE
  • Publication number: 20190170374
    Abstract: An air conditioner comprises a compressor configured to have an inlet, through which a refrigerant is sucked in, the sucked refrigerant being compressed by the compressor, and an outlet, through which the compressed refrigerant is discharged, a four-way valve configured to switch flow paths in cooling and heating operations, the four-way valve having a valve body, a D port protruding from the valve body in a first direction to be connected to the outlet, and an S port 26 protruding from the valve body in a second direction, which is opposite to the first direction, to be connected to the inlet, and a compressor pipe having a discharging pipe to connect the outlet and the D port and a sucking pipe to connect the inlet and the S port, one of the discharging pipe and the sucking pipe has two curved portions and the other has one curved portion.
    Type: Application
    Filed: December 5, 2018
    Publication date: June 6, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mun Sub KIM, Hyeong Joon SEO, Hyeong Jin LEE, Du Han JUNG