Patents by Inventor Hyeong Kug Jin

Hyeong Kug Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with molding vents
    Patent number: 7863761
    Abstract: An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: January 4, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin, JongMin Han, SungJae Lim, HyoungChul Kwon
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDING VENTS
    Publication number: 20080029873
    Abstract: An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.
    Type: Application
    Filed: August 3, 2007
    Publication date: February 7, 2008
    Inventors: Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin, JongMin Han, SungJae Lim, HyoungChul Kwon