Patents by Inventor Hyeong Ryeol Hur

Hyeong Ryeol Hur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for semiconductor package with stacked dies
    Patent number: 6833287
    Abstract: A semiconductor package with stacked dies and method of assembly is provided. A first die is attached to a substrate. A protective layer is placed on the first die over a central area thereof. The first die is electrically connected to the substrate. An intermediate adhesive layer is applied over the protective layer. A second die is attached to the intermediate adhesive layer and electrically connected to the substrate.
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: December 21, 2004
    Assignee: ST Assembly Test Services Inc.
    Inventors: Hyeong Ryeol Hur, Henry D. Bathan, Zigmund R. Camacho
  • SYSTEM FOR SEMICONDUCTOR PACKAGE WITH STACKED DIES
    Publication number: 20040251526
    Abstract: A semiconductor package with stacked dies and method of assembly is provided. A first die is attached to a substrate. A protective layer is placed on the first die over a central area thereof. The first die is electrically connected to the substrate. An intermediate adhesive layer is applied over the protective layer. A second die is attached to the intermediate adhesive layer and electrically connected to the substrate.
    Type: Application
    Filed: June 16, 2003
    Publication date: December 16, 2004
    Applicant: ST ASSEMBLY TEST SERVICES LTD.
    Inventors: Hyeong Ryeol Hur, Henry D. Bathan, Zigmund R. Camacho