Patents by Inventor Hyeongseob Shin

Hyeongseob Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958965
    Abstract: Provided are a thermoplastic resin composition and a molded product using same, wherein the thermoplastic resin composition includes a base resin including (A-1) 10 wt % to 30 wt % of a first acrylate-based graft copolymer having an acrylate-based rubbery polymer with an average particle diameter of 300 nm to 400 nm; (A-2) 10 wt % to 35 wt % of a second acrylate-based graft copolymer having an acrylate-based rubbery polymer with an average particle diameter of 100 nm to 200 nm; (B) 10 wt % to 15 wt % of an aromatic vinyl compound-vinyl cyanide compound copolymer; and (C) 35 wt % to 55 wt % of ?-methylstyrene-based copolymer, and (D) 1 to 5 parts by weight of an ultrahigh molecular weight styrene-acrylonitrile copolymer having a weight average molecular weight of greater than or equal to 5,000,000 g/mol, based on 100 parts by weight of the base resin.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: April 16, 2024
    Assignee: Lotte Chemical Corporation
    Inventors: Jieun Park, Keehae Kwon, Younghyo Kim, Jungwook Kim, Hyeongseob Shin
  • Publication number: 20240018348
    Abstract: Provided are a thermoplastic resin composition and a molded product using the same, the thermoplastic resin composition including (A) 10 wt % to 30 wt % of an acrylate-based rubber modified aromatic vinyl-vinyl cyanide graft copolymer; (B) 10 wt % to 30 wt % of a composite rubber modified aromatic vinyl-vinyl cyanide graft copolymer; (C) 10 wt % to 40 wt % of a polyalkyl (meth)acrylate resin; and (D) 20 wt % to 50 wt % of an alpha-methylstyrene-based copolymer.
    Type: Application
    Filed: December 29, 2021
    Publication date: January 18, 2024
    Inventors: Hyeongseob SHIN, Keehae KWON, In-Chol KIM, Jaekeun HONG
  • Patent number: 11814513
    Abstract: Provided are a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition comprising: (A) 30 to 50 wt % of an acrylate-based graft copolymer; (B) 20 to 50 wt % of a poly(methyl methacrylate) resin; (C) 0 to 40 wt % of a methyl methacrylate-styrene-acrylonitrile copolymer; and (D) 5 to 15 wt % of a styrene-methyl methacrylate-maleic anhydride copolymer having a maleic anhydride-derived component content of 20 to 25 wt %.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: November 14, 2023
    Assignee: Lotte Chemical Corporation
    Inventors: Hyeongseob Shin, In-Chol Kim, Keehae Kwon
  • Publication number: 20230039123
    Abstract: Provided are a thermoplastic resin composition and a molded product manufactured therefrom, the thermoplastic resin composition including (A) 10 to 40 wt % of an acrylic graft copolymer that includes a core including an acrylic rubbery polymer, and a shell formed by graft polymerization of a monomer to the core, the monomer including an alkyl (meth)acrylate, an aromatic vinyl compound, a vinyl cyanide compound, or a combination thereof; (B) 30 to 60 wt % of a polyalkyl (meth)acrylate resin; and (C) 10 to 40 wt % of an N-(substituted)maleimide-acrylic copolymer.
    Type: Application
    Filed: October 28, 2020
    Publication date: February 9, 2023
    Inventors: In-Chol KIM, Hyeongseob SHIN, Keehae KWON, Jaekeun HONG
  • Patent number: 11492481
    Abstract: This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt % of a (meth)acrylic resin, (B) 10 to 30 wt % of an acrylic graft copolymer, and (C) 5 to 10 wt % of a maleimide-based heat-resistant copolymer and a molded product using the same.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: November 8, 2022
    Assignee: Lotte Chemical Corporation
    Inventors: Hyeongseob Shin, Keehae Kwon, Younghyo Kim, In-Chol Kim, Jieun Park
  • Publication number: 20210395510
    Abstract: Provided are a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition comprising: (A) 30 to 50 wt % of an acrylate-based graft copolymer; (B) 20 to 50 wt % of a poly(methyl methacrylate) resin; (C) 0 to 40 wt % of a methyl methacrylate-styrene-acrylonitrile copolymer; and (D) 5 to 15 wt % of a styrene-methyl methacrylate-maleic anhydride copolymer having a maleic anhydride-derived component content of 20 to 25 wt %.
    Type: Application
    Filed: October 28, 2019
    Publication date: December 23, 2021
    Inventors: Hyeongseob SHIN, In-Chol KIM, Keehae KWON
  • Publication number: 20210061984
    Abstract: This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt % of a (meth)acrylic resin, (B) 10 to 30 wt % of an acrylic graft copolymer, and (C) 5 to 10 wt % of a maleimide-based heat-resistant copolymer and a molded product using the same. SACLIENTS\7020\234\7020.234 English spec (OPP20201939_O2019132304).
    Type: Application
    Filed: December 7, 2018
    Publication date: March 4, 2021
    Inventors: Hyeongseob SHIN, Keehae KWON, Younghyo KIM, In-Chol KIM, Jieun PARK
  • Publication number: 20210024735
    Abstract: Provided are a thermoplastic resin composition and a molded product using same, wherein the thermoplastic resin composition includes a base resin including (A-1) 10 wt % to 30 wt % of a first acrylate-based graft copolymer having an acrylate-based rubbery polymer with an average particle diameter of 300 nm to 400 nm; (A-2) 10 wt % to 35 wt % of a second acrylate-based graft copolymer having an acrylate-based rubbery polymer with an average particle diameter of 100 nm to 200 nm; (B) 10 wt % to 15 wt % of an aromatic vinyl compound-vinyl cyanide compound copolymer; and (C) 35 wt % to 55 wt % of ?-methylstyrene-based copolymer, and (D) 1 to 5 parts by weight of an ultrahigh molecular weight styrene-acrylonitrile copolymer having a weight average molecular weight of greater than or equal to 5,000,000 g/mol, based on 100 parts by weight of the base resin.
    Type: Application
    Filed: April 1, 2019
    Publication date: January 28, 2021
    Inventors: Jieun PARK, Keehae KWON, Younghyo KIM, Jungwook KIM, Hyeongseob SHIN
  • Patent number: 10626266
    Abstract: Disclosed are a thermoplastic resin composition including (C) about 1 part by weight to about 6 parts by weight of a copolymer including a styrene-acrylonitrile copolymer graft-copolymerized on polystyrene and having a weight average molecular weight of greater than or equal to about 1,000,000 g/mol and (D) about 0.1 part by weight to about 1 part by weight of an aluminum particle, based on about 100 parts by weight of a base resin including (A) about 25 wt % to about 45 wt % of an acryl-based graft copolymer; and (B) about 55 wt % to about 75 wt % of an aromatic vinyl-vinyl cyanide copolymer, and a molded product using the same.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: April 21, 2020
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Jieun Park, Keehae Kwon, Doo Young Kim, Hyeongseob Shin
  • Publication number: 20180171131
    Abstract: Disclosed are a thermoplastic resin composition including (C) about 1 part by weight to about 6 parts by weight of a copolymer including a styrene-acrylonitrile copolymer graft-copolymerized on polystyrene and having a weight average molecular weight of greater than or equal to about 1,000,000 g/mol and (D) about 0.1 part by weight to about 1 part by weight of an aluminum particle, based on about 100 parts by weight of a base resin including (A) about 25 wt % to about 45 wt % of an acryl-based graft copolymer; and (B) about 55 wt % to about 75 wt % of an aromatic vinyl-vinyl cyanide copolymer, and a molded product using the same.
    Type: Application
    Filed: December 18, 2017
    Publication date: June 21, 2018
    Inventors: Jieun Park, Keehae Kwon, Doo Young Kim, Hyeongseob Shin