Patents by Inventor HYEONG SEOK CHOO

HYEONG SEOK CHOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984338
    Abstract: A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: May 14, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youn Gon Oh, Ji Hun Kim, Seung Gu Bang, Sung-Hoon Lee, Ho Chan Lee, Hyeong Seok Choo
  • Publication number: 20230230864
    Abstract: A semiconductor fabrication facility including raceways on a ceiling of a structural construction and extending in one direction, a vehicle rail assembly coupled to the raceways, outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly, and an outer jig on the outer jig rails and configured to allow the vehicle rail assembly to move along the outer jig rails may be provided.
    Type: Application
    Filed: August 24, 2022
    Publication date: July 20, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Youngon OH, Youngcheol JANG, Jihun KIM, Sanghyuk PARK, Sangho YOON, SeungYeob LEE, Chul Min LEE, Hochan LEE, Jaegyun JEON, Jeongkwan JUNG, Hyeong Seok CHOO, Dongyeol HAN
  • Publication number: 20230133865
    Abstract: A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.
    Type: Application
    Filed: May 16, 2022
    Publication date: May 4, 2023
    Inventors: YOUN GON OH, JI HUN KIM, SEUNG GU BANG, SUNG-HOON LEE, HO CHAN LEE, HYEONG SEOK CHOO