Patents by Inventor Hyeong Seok Im

Hyeong Seok Im has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device package and manufacturing method thereof
    Patent number: 8587118
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening and side openings. The first and second lead frames pass through the housing to extend to an outside. A portion of each lead frame being exposed through the front opening. The light emitting device is in the front opening and electrically connected to the first and second lead frames. A protrusion protruding in a direction of the side opening is formed on an inner surface of the side opening.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: November 19, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Myung Gi Kim, Hyeong Seok Im
  • Light emitting device package
    Patent number: 8344400
    Abstract: Embodiments relate to a light emitting device package. The light emitting device package comprises: a body comprising a multilayer cavity; a light emitting device in the cavity; a first phosphor layer sealing the light emitting device and comprising a first phosphor; and a second phosphor layer comprising a second phosphor on the first phosphor layer, the second phosphor and the first phosphor having a difference in the specific gravity.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: January 1, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Choong Youl Kim, Hyeong Seok Im, Joong In An
  • LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20100237370
    Abstract: Embodiments relate to a light emitting device package. The light emitting device package comprises: a body comprising a multilayer cavity; a light emitting device in the cavity; a first phosphor layer sealing the light emitting device and comprising a first phosphor; and a second phosphor layer comprising a second phosphor on the first phosphor layer, the second phosphor and the first phosphor having a difference in the specific gravity.
    Type: Application
    Filed: August 26, 2008
    Publication date: September 23, 2010
    Inventors: Choong Youl Kim, Hyeong Seok Im, Joong In An
  • LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100171144
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening and side openings. The first and second lead frames pass through the housing to extend to an outside. A portion of each lead frame being exposed through the front opening. The light emitting device is in the front opening and electrically connected to the first and second lead frames. A protrusion protruding in a direction of the side opening is formed on an inner surface of the side opening.
    Type: Application
    Filed: June 19, 2008
    Publication date: July 8, 2010
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Min Kong, Myung Gi Kim, Hyeong Seok Im
  • Light-emitting diode (LED)
    Patent number: D580893
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: November 18, 2008
    Assignee: LG Innotek Co., Ltd
    Inventor: Hyeong Seok Im
  • Light-emitting diode (LED)
    Patent number: D585849
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: February 3, 2009
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hyeong Seok Im
  • Light-emitting diode (LED)
    Patent number: D597967
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: August 11, 2009
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hyeong Seok Im