Patents by Inventor Hyeong Uk ROH

Hyeong Uk ROH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for reproducing component of semiconductor manufacturing apparatus, and reproduced component
    Patent number: 10586687
    Abstract: A method and apparatus for reproducing a component of a semiconductor manufacturing apparatus, and a reproduced component are provided. The method may include a preparing step of preparing a damaged component of a semiconductor manufacturing apparatus, a first cleaning step of cleaning the damaged component, a masking step of masking at least one of areas including an undamaged part of the damaged component, a reproduced part forming step of forming a reproduced part on the damaged component using a chemical vapor deposition (CVD), a post-grinding step of grinding the damaged component with the reproduced part, and a second cleaning step of cleaning the damaged component with the reproduced part.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: March 10, 2020
    Assignee: TOKAI CARBON KOREA CO., LTD.
    Inventors: Ki Won Kim, Hyeong Uk Roh, Jong Sung Yun, Won Pyo Hong
  • METHOD AND APPARATUS FOR REPRODUCING COMPONENT OF SEMICONDUCTOR MANUFACTURING APPARATUS, AND REPRODUCED COMPONENT
    Publication number: 20170345624
    Abstract: A method and apparatus for reproducing a component of a semiconductor manufacturing apparatus, and a reproduced component are provided. The method may include a preparing step of preparing a damaged component of a semiconductor manufacturing apparatus, a first cleaning step of cleaning the damaged component, a masking step of masking at least one of areas including an undamaged part of the damaged component, a reproduced part forming step of forming a reproduced part on the damaged component using a chemical vapor deposition (CVD), a post-grinding step of grinding the damaged component with the reproduced part, and a second cleaning step of cleaning the damaged component with the reproduced part.
    Type: Application
    Filed: December 29, 2016
    Publication date: November 30, 2017
    Inventors: Ki Won KIM, Hyeong Uk ROH, Jong Sung YUN, Won Pyo HONG