Abstract: The method includes forming a metal interconnection layer and a first interlayer insulating layer on a semiconductor substrate, forming a reservoir capacitor region by etching the first interlayer insulating layer to expose the metal interconnection layer, forming a barrier metal layer on the reservoir capacitor region, forming a sacrificial insulating layer on the barrier metal layer in a lower portion of the reservoir capacitor region, performing a pre-cleaning process to remove the barrier metal layer on a sidewall of the reservoir capacitor region, and removing the sacrificial insulating layer.

Abstract: The method includes forming a metal interconnection layer and a first interlayer insulating layer on a semiconductor substrate, forming a reservoir capacitor region by etching the first interlayer insulating layer to expose the metal interconnection layer, forming a barrier metal layer on the reservoir capacitor region, forming a sacrificial insulating layer on the barrier metal layer in a lower portion of the reservoir capacitor region, performing a pre-cleaning process to remove the barrier metal layer on a sidewall of the reservoir capacitor region, and removing the sacrificial insulating layer.

Abstract: A semiconductor device and a method for manufacturing the same are disclosed. When forming a profile of the lower electrode, a second lower electrode hole (i.e., a bunker region) located at the lowermost part of the lower electrode is buried with an Ultra Low Temperature Oxide (ULTO) material without damaging the lower electrode material. As a result, when a dielectric film is deposited in a subsequent process, the above-mentioned semiconductor device prevents the occurrence of a capacitor leakage current caused by defective gapfilling of the dielectric film located at the lowermost part of the lower electrode.

Abstract: The method includes forming a metal interconnection layer and a first interlayer insulating layer on a semiconductor substrate, forming a reservoir capacitor region by etching the first interlayer insulating layer to expose the metal interconnection layer, forming a barrier metal layer on the reservoir capacitor region, forming a sacrificial insulating layer on the barrier metal layer in a lower portion of the reservoir capacitor region, performing a pre-cleaning process to remove the barrier metal layer on a sidewall of the reservoir capacitor region, and removing the sacrificial insulating layer.

Abstract: A semiconductor device and a method for manufacturing the same are disclosed. When forming a profile of the lower electrode, a second lower electrode hole (i.e., a bunker region) located at the lowermost part of the lower electrode is buried with an Ultra Low Temperature Oxide (ULTO) material without damaging the lower electrode material. As a result, when a dielectric film is deposited in a subsequent process, the above-mentioned semiconductor device prevents the occurrence of a capacitor leakage current caused by defective gapfilling of the dielectric film located at the lowermost part of the lower electrode.