Patents by Inventor Hyeongjun CHO

Hyeongjun CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250148706
    Abstract: Disclosed is a three-dimensional (3D) calibration method and device for multi-view phase shift profilometry. A 3D calibration method for multi-view phase shift profilometry, performed by a computer device, according to an example embodiment may include acquiring a phase that is data required for 3D reconstruction from parameters of at least one camera and a projector based on a phase measuring profilometry (PMP) method; defining a phase-to-depth function for each camera-and-projector combination and performing calibration of optimizing the parameters of the camera and the projector; and acquiring a point cloud that includes depth information using the optimized parameters of the camera and the projector.
    Type: Application
    Filed: November 15, 2023
    Publication date: May 8, 2025
    Inventors: Min Hyuk KIM, Hyeongjun CHO
  • Publication number: 20240243801
    Abstract: The present invention provides a multi-faceted signal amplification repeater including N (N is an integer of 3 or more) repeater modules surrounding a cable for signal transmission between a transmitting end and a receiving end; and N connect pins connecting the N repeater modules to each other, wherein among the N repeater modules, M (M is an integer greater than or equal to 1 but less than N) repeater modules are repeater units that amplify a signal transmitted through the cable, and among the N repeater modules, L (L is an integer equal to N?M) power units are power units that supply power for an operation of the repeater units.
    Type: Application
    Filed: January 10, 2024
    Publication date: July 18, 2024
    Inventors: Jongsuk WON, Hyeongjun CHO
  • Publication number: 20210112662
    Abstract: Disclosed is a wafer-type sensor unit. The wafer-type sensor unit according to an embodiment of the inventive concept may include a circuit board and an electronic element including a sensor installed on the circuit board. The electronic element may be disposed on the circuit board such that a center of gravity of the wafer-type sensor unit is provided to a center part of the sensor unit. The electronic element may further include a power supply unit and a signal processing unit processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Yong-Jun SEO, Sanghyun SON, Sangmin HA, Hyeongjun CHO, Dongok AHN