Patents by Inventor Hyeongmin JE

Hyeongmin JE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing, design and manufacturing method thereof using 3D printing
    Patent number: 11926041
    Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: March 12, 2024
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sanha Kim, Donggeun Kim, Hyeongmin Je
  • THREE-DIMENSIONAL ELECTROMECHANICAL ADHESIVE SURFACE STRUCTURE CAPABLE OF ADHESIVE FORCE MANIPULATION AND TACTILE SENSING, DESIGN AND MANUFACTURING METHOD THEREOF USING 3D PRINTING
    Publication number: 20210122064
    Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 29, 2021
    Inventors: Sanha KIM, Donggeun KIM, Hyeongmin JE