Abstract: A thin film transistor array panel includes: a substrate; a gate electrode disposed on the substrate; a semiconductor layer disposed on the substrate and overlapping the gate electrode; a plurality of nano particles disposed on or in the semiconductor layer; a source electrode disposed on the substrate; and a drain electrode disposed on the substrate, where the source electrode and the drain electrode are spaced apart from each other, and the semiconductor layer is disposed between the source electrode and the drain electrode, in which a diameter of each of the nano particles is in a range of about 2 nm to about 5 nm, or a ratio of a plane area of the nano particles per unit area of the semiconductor layer is in a range of about 5% to about 80%.

Abstract: A thin film transistor array panel includes: a substrate; a gate electrode disposed on the substrate; a semiconductor layer disposed on the substrate and overlapping the gate electrode; a plurality of nano particles disposed on or in the semiconductor layer; a source electrode disposed on the substrate; and a drain electrode disposed on the substrate, where the source electrode and the drain electrode are spaced apart from each other, and the semiconductor layer is disposed between the source electrode and the drain electrode, in which a diameter of each of the nano particles is in a range of about 2 nm to about 5 nm, or a ratio of a plane area of the nano particles per unit area of the semiconductor layer is in a range of about 5% to about 80%.

Abstract: A photoelectrode for a photoelectrochemical cell, a method of manufacturing the same, and a photoelectrochemical cell including the same, the photoelectrode including TiO2 nanotubes, and a TiO2 layer coated on the TiO2 nanotubes.

Abstract: A nanocomposite structure, including: TiO2 nanotubes; and nanoparticles uniformly formed on surfaces of the TiO2 nanotubes.

Abstract: A nanorod and a method of manufacturing the same are disclosed, and a nanorod including a ZnO nanorod; and a coating layer disposed on a ZnO surface and including RuO2 nanoparticles are disclosed concretely.

Abstract: Provided is an apparatus for generating remote plasma, which can improve thin-film quality by preventing an arc at a bias electrode. The apparatus includes a radio frequency (RF) electrode installed inside an upper portion of a chamber, a bias electrode installed apart from the RF electrode, and including a plurality of through holes through which plasma passes, wherein a bias power is supplied to the bias electrode, a plasma generating unit formed between the RF electrode and the bias electrode, wherein a plasma gas is supplied to the plasma generating unit, and a ground electrode installed under and spaced apart from the bias electrode, and including plasma through holes corresponding to the through holes of the bias electrode, wherein a pulsed DC bias of a second voltage level, which has a first voltage level periodically, is applied to the bias electrode.

Abstract: Provided is an apparatus for generating remote plasma, which can improve thin-film quality by preventing an arc at a bias electrode. The apparatus includes a radio frequency (RF) electrode installed inside an upper portion of a chamber, a bias electrode installed apart from the RF electrode, and including a plurality of through holes through which plasma passes, wherein a bias power is supplied to the bias electrode, a plasma generating unit formed between the RF electrode and the bias electrode, wherein a plasma gas is supplied to the plasma generating unit, and a ground electrode installed under and spaced apart from the bias electrode, and including plasma through holes corresponding to the through holes of the bias electrode, wherein a pulsed DC bias of a second voltage level, which has a first voltage level periodically, is applied to the bias electrode.

Abstract: A metal suicide layer is fabricated in a semiconductor device. A first metal layer is deposited on a silicon substrate formed with an S interlayer dielectric having a contact hole through PVD. A second metal layer is deposited on the first metal layer through any one of CVD and ALD. Annealing is performed on the silicon substrate which is formed with the first and second metal layers to form the metal silicide. The portions of the second metal layer and the first metal layer which have not reacted during annealing are removed.

Abstract: A conventional plasma applied ALD apparatus has a problem in that physical shock is directly imposed on a substrate and a thin film thereby damaging the thin film. Further, many reports have said that since an apparatus for controlling plasma energy is not arranged well, the thin film is not formed uniformly due to plasma nonuniformity. Therefore, there is provided a remote plasma atomic layer deposition apparatus using a DC bias comprising: a reaction chamber having an inner space; a substrate supporting body on which a substrate on which a thin film is to be formed is loaded arranged at one side of the inner space of the reaction chamber; a remote plasma generating unit arranged outside of the reaction chamber to supply a remote plasma into the inner space of the reaction chamber; a DC bias unit controlling energy of the remote plasma; and a source gas supply unit supplying a source gas for forming the thin film into the reaction chamber.

Abstract: Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a tinted thin film layer over the LED chip that changes the color of the emitted light. For example, a blue-light emitting LED chip can be used to produce white light. The tinted thin film layer beneficially consists of ZnSe, CeO2, Al2O3, or Y2O3:Ce that is deposited using a chemical vapor deposition process, such as metal organic chemical vapor deposition (MOCVD), atomic layer chemical vapor deposition (ALD), plasma enhanced MOCVD, plasma enhanced ALD, and/or photo enhanced CVD. Suitable CVD precursors include Alkoxide, ?-dikeonate, Metalloscene, Alkys, DMZn, DEZe, H2Se, DMSe, TbuSe, and DESe.

Abstract: A method of fabricating a light emitting diode (LED) includes providing an LED chip that emits light having a first wavelength where the LED chip includes a first electrical contact and a second electrical contact. The method further includes forming a tinted thin film layer over the LED chip where the tinted thin film layer interacts with the first wavelength light to produce a light having a second wavelength.

Abstract: Provided is an apparatus for generating remote plasma. The apparatus includes an RF antenna disposed in regard to a chamber, a plasma generating unit formed in an uppermost portion of the chamber, wherein a plurality of plasma generation gas introduction pipes are communicated with the plasma generating unit, a first shower head disposed below the plasma generating unit, and having a plurality of first plasma guide holes, a second shower head disposed below the first shower head, and having a plurality of source/purge gas guide holes and a plurality of second plasma guide holes directly connected to the respective first plasma guide holes, and a source/purge gas introduction unit disposed between the first and second shower heads, wherein a plurality of source/purge gas introduction pipes are uniformly communicated with the source/purge gas introduction unit.

Abstract: Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a tinted thin film layer over the LED chip that changes the color of the emitted light. For example, a blue-light emitting LED chip can be used to produce white light. The tinted thin film layer beneficially consists of ZnSe, CeO2, Al2O3, or Y2O3:Ce that is deposited using a chemical vapor deposition process, such as metal organic chemical vapor deposition (MOCVD), atomic layer chemical vapor deposition (ALD), plasma enhanced MOCVD, plasma enhanced ALD, and/or photo enhanced CVD. Suitable CVD precursors include Alkoxide, &bgr;-dikeonate, Metalloscene, Alkys, DMZn, DEZe, H2Se, DMSe, ThuSe, and DESe.

Abstract: Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a tinted thin film layer over the LED chip that changes the color of the emitted light. For example, a blue-light emitting LED chip can be used to produce white light. The tinted thin film layer beneficially consists of ZnSe, CeO2, Al2O3, or Y2O3:Ce that is deposited using a chemical vapor deposition process, such as metal organic chemical vapor deposition (MOCVD), atomic layer chemical vapor deposition (ALD), plasma enhanced MOCVD, plasma enhanced ALD, and/or photo enhanced CVD. Suitable CVD precursors include Alkoxide, &bgr;-dikeonate, Metalloscene, Alkys, DMZn, DEZe, H2Se, DMSe, TbuSe, and DESe.