Abstract: An image sensor is disclosed. The image sensor includes a plurality of pixels, a plurality of transmission lines connected to each of the pixels, respectively, and a plurality of comparators configured to compare each of a plurality of control signals transmitted through each of the transmission lines with a reference signal and output a comparative signal based on the result of the comparison.

Abstract: A semiconductor device includes a semiconductor chip comprising a semiconductor substrate including microelectronic devices, first interconnection lines disposed on the semiconductor substrate and electrically connected to the microelectronic devices, pads connected to the first interconnection lines, wherein the pads are disposed on an edge of the semiconductor chip, and an interconnection substrate disposed on the semiconductor substrate, wherein the interconnection substrate includes second interconnection lines connected to a part of the pads, wherein a maximum distance between the pads is less than half a length of one side of the semiconductor chip, and heights of the pads are substantially the same.