Abstract: A semiconductor package includes a first semiconductor chip including a circuit layer on a first substrate, first through silicon vias passing through the first substrate, first lower bump pads on the circuit layer, and a first upper bump pad and a second upper bump pad on a second surface of the first substrate, each of the first upper bump pad and the second upper bump pad connected to a corresponding one of the first through silicon vias. The package includes a second semiconductor chip including a circuit layer on a first surface of a second substrate, and second lower bump pads on the circuit layer on the second substrate. The package includes a first solder bump to bond the first upper bump pad and the second lower bump pad, and a plurality of second solder bumps to bond the second upper bump pad and the second lower bump pads.

Abstract: A semiconductor package includes an interposer including a first redistribution layer and a second redistribution layer that is on the first redistribution layer and is electrically coupled to the first redistribution layer; and a semiconductor chip on the interposer. The first redistribution layer includes a first organic insulating layer and a plurality of first conductors in the first organic insulating layer. The second redistribution layer includes a second organic insulating layer, a first silicon insulating layer on the second organic insulating layer, and a plurality of second conductors penetrating through both the second organic insulating layer and the first silicon insulating layer. The semiconductor chip includes a second silicon insulating layer and a plurality of third conductors in the second silicon insulating layer.

Abstract: A cleaner includes: a suction motor that generates suction force; a dust separation unit that separates dust from air sucked by the suction force; a motor housing that covers the suction motor; a flow guide that surrounds an outer side of the motor housing and guides air discharged from the dust separation unit to the suction motor; and a body that forms an external appearance by surrounding the flow guide and guides air discharged from the suction motor together with the flow guide.

Abstract: A semiconductor package includes a redistribution substrate, a sub-package disposed on the redistribution substrate, a semiconductor chip disposed on the redistribution substrate, a heat dissipation structure disposed on the redistribution substrate and surrounding the sub-package and the semiconductor chip, and an encapsulant. The redistribution substrate includes a redistribution structure. The semiconductor chip is positioned side-by-side with the sub-package. The encapsulant encapsulates the sub-package, the semiconductor chip, and the heat dissipation structure.

Abstract: Provided is a semiconductor package including a lower redistribution structure, an internal semiconductor chip on an upper surface of the lower redistribution structure, an upper redistribution structure electrically connected to the lower redistribution structure through a conductive post, and a molding layer between the upper redistribution structure and the lower redistribution structure, the molding layer being adjacent to the internal semiconductor chip, wherein the upper redistribution structure includes an insulating layer including a redistribution pattern and a first material configured to transmit light, and a fiducial mark formed of the first material, and a lower surface of the fiducial mark is in contact with an upper surface of the molding layer.

Abstract: A semiconductor package includes a first redistribution structure, a first semiconductor device mounted on the first redistribution structure, a molding layer surrounding the first semiconductor device, a second redistribution structure disposed on the molding layer and the first semiconductor device, a plurality of vertical connection conductors vertically extending in the molding layer and electrically connecting the first redistribution pattern to the second redistribution pattern, a second semiconductor device mounted on the second redistribution structure, the second semiconductor device and the first semiconductor device vertically and partially overlapping each other, a heat dissipation pad structure contacting an upper surface of the first semiconductor device, and a heat dissipation plate disposed on the heat dissipation pad structure and spaced apart from the second semiconductor device along a first straight line extending in a horizontal direction that is parallel to the upper surface of the first

Abstract: An image sensor package includes a glass substrate configured to focus incident light, a first redistribution layer and a second redistribution layer both disposed under the glass substrate while being horizontally spaced apart from each other by a first distance, an image sensor disposed such that an upper surface thereof is vertically spaced apart from both a lower surface of the first redistribution layer and a lower surface of the second redistribution layer by a second distance, and a first connector that connects both the first redistribution layer and the second redistribution layer to the image sensor. The thickness of the glass substrate is 0.6 to 0.8 mm. The first distance is smaller than the horizontal length of the image sensor by 50 ?m to 1 mm. The second distance is equal to or less than 0.1 mm.

Abstract: A semiconductor package includes: a first redistribution structure including at least one first redistribution layer and at least one first insulating layer; a first semiconductor chip electrically connected to the at least one first redistribution layer and disposed on a first surface of the first redistribution structure; a second semiconductor chip disposed on an upper surface of the first semiconductor chip; a first encapsulant disposed on a second surface of the first redistribution structure opposite the first surface of the first redistribution layer; first conductive posts electrically connected to the first semiconductor chip and penetrating the first encapsulant; and under bump metallurgy (UBM) structures disposed on a lower surface of the first encapsulant, wherein at least a portion of the UBM structures overlap at least a portion of the first conductive posts in a penetration direction of the first conductive posts and are connected to the first conductive posts.

Abstract: A cleaner includes: a suction motor that generates suction force; a dust separation unit disposed under the suction motor and separates dust from air; a handle disposed behind the suction motor; and a battery disposed under the handle and behind the dust separation unit to supply power to the suction motor.

Abstract: A semiconductor package includes a redistribution structure in which at least one redistribution layer and at least one insulating layer are alternately stacked; a semiconductor chip electrically connected to the at least one redistribution layer; and bumps on the redistribution structure, wherein the redistribution structure includes vias extending from the at least one redistribution layer in a vertical stacking direction of the redistribution structure; and under bump metallurgy (UBM) structures electrically connected between the vias and the bumps and configured to face the bumps in the vertical stacking direction of the redistribution structure, wherein each of the UBM structures includes a first UBM layer including a first metal material or an alloy of the first metal material; and a second UBM layer between one of the bumps and the first UBM layer and including a second metal material.

Abstract: A cleaner includes: a main body that has an opening; a suction motor that is disposed in the main body and generates suction force; and a filter unit that includes an exhaust filter for filtering air discharged from the suction motor, the filter unit being inserted into the main body through the opening and being separated from the main body, wherein when the filter unit is combined with the main body, a portion of the filter unit protrudes out of the main body, and a portion of the exhaust filter is positioned inside the main body and the other portion of the exhaust filter is positioned outside the main body.

Abstract: A packaged integrated circuit includes a redistribution layer having a plurality of electrically conductive vias extending at least partially therethrough, and a plurality of lower pads electrically connected to corresponding ones of the plurality of electrically conductive vias. A semiconductor chip is provided on the redistribution layer, and external connection terminals are provided, which electrically contact corresponding ones of the plurality of lower pads within the redistribution layer. Each of the plurality of lower pads includes: (i) a lower under-bump metallization (UBM) layer in contact with a corresponding external connection terminal, and (ii) an upper UBM layer extending on and contacting the lower UBM layer. In addition, an upper surface of the lower UBM layer has a greater lateral width dimension relative to an upper surface of the upper UBM layer, which contacts a corresponding electrically conductive via.

Abstract: A user terminal device includes a display; at least one sensor; a communication module; and a processor operatively connected to the display, the at least one sensor, and the communication module, wherein the processor is configured to, based on receiving a user utterance voice, determine whether or not a response screen corresponding to the user utterance voice is able to be provided through the display on the basis of at least one of a sensed value obtained from the at least one sensor or an inactive period of the display, based on determining that the response screen is unable to be provided through the display, receive current status information of at least one external device connected to the user terminal device through the communication module, determine one external device among the at least one external device to display the response screen on the basis of the current status information of the at least one external device, obtain the response screen to the user utterance voice, and transmit the respo

Abstract: According to various embodiments, an electronic device comprising a memory; a communication module; and a processor, operatively connected to the memory and the communication module, and configured to, if a locked state of the electronic device and a first state of the electronic device are identified, when a first user utterance is acquired that requests a task executable in an unlocked state of the electronic device, change an unlocking type of the electronic device to an unlocking type of an external device, based on first information of the external device, the external device being communicatively connected to the electronic device through the communication module, unlock the electronic device, which is configured with the unlocking type of the external device, based on user authentication information acquired from the external device, and execute the task corresponding to the first user utterance. Various other embodiments may be provided.

Abstract: A user terminal device includes a display; at least one sensor; a communication module; and a processor operatively connected to the display, the at least one sensor, and the communication module, wherein the processor is configured to, based on receiving a user utterance voice, determine whether or not a response screen corresponding to the user utterance voice is able to be provided through the display on the basis of at least one of a sensed value obtained from the at least one sensor or an inactive period of the display, based on determining that the response screen is unable to be provided through the display, receive current status information of at least one external device connected to the user terminal device through the communication module, determine one external device among the at least one external device to display the response screen on the basis of the current status information of the at least one external device, obtain the response screen to the user utterance voice, and transmit the respo

Abstract: An electronic device is provided. The electronic device includes a processor and a memory storing instructions which, when executed by the processor, cause the processor to obtain information of a wireless audio device wirelessly connectable to the electronic device, determine whether an utterance of a user is a device-controlling utterance for a target device which is a target of remote control in response to the information of the wireless audio device, and suggest switching a connection of the wireless audio device to the target device based on an intent in the utterance of the user. Other example embodiments, in addition to the foregoing example embodiment, are also applicable.

Abstract: According to an example embodiment, an electronic device includes: a memory storing instructions and a processor electrically connected to the memory and configured to execute the instructions. The instructions, when executed by the processor, cause the processor to: determine whether an utterance is a device-controlling utterance for a target device to be remotely controlled, verify a distance between the electronic device and the target device based on the utterance being the device-controlling utterance, and output an object generated differently based on whether the distance is a short distance less than or equal to a specified distance or a long distance greater than the specified distance.

Abstract: An electronic device and method are disclosed herein. The electronic device includes a communication circuit, a processor, and a memory. The processor implements the method, including: receiving, from each of one or more external devices receiving a voice signal of a user, via the communication circuit, a first probability value based on usage frequency, and a second probability value based on signal-to-noise (SNR) magnitude, calculating final probability values for each of the one or more external devices, based on respective first and second probability values of each of the one or more external devices, and selecting an external device from among the one or more external devices having a highest final probability value from among the calculated final probability values.

Abstract: An electronic device is provided. The electronic device includes a voice input device, a communication circuit, a display, a processor operatively connected to the voice input device, the communication circuit, and the display, and a memory operatively connected to the processor. The memory may store one or more instructions that, when executed, cause the processor to receive a first utterance from a first user through the voice input device, to communicatively connect to a first external electronic device based on the first utterance, to display, to the display, a first user interface indicating a state of communicatively connecting to the first external electronic device, and to display, to the display, a second user interface indicating that the electronic device and the second external electronic device are simultaneously connected to the first external electronic device when the first external electronic device is communicatively connected to a second external electronic device.

Abstract: Provided is a simulation spectrum apparatus including: a background image acquisition unit that acquires a background image of a target region and an infrared signal corresponding to each pixel of the background image; a spectrum acquisition unit that acquires a background radiation intensity spectrum from the infrared signal acquired for the each pixel; a simulation spectrum generation unit that generates a model of a linear combination of a radiation intensity spectrum of a contamination cloud and a background radiation intensity spectrum on the basis of a difference in radiation intensity; a controller that generates a simulation spectrum of the contamination cloud by applying the information on the at least one toxic substance and the atmosphere transmittance to the model of the linear combination; and an imaging unit that generates a spectrum image, combines the generated spectrum image and the background image, and thus generates a simulation contamination cloud image.