Patents by Inventor Hyeonseop SHIN

Hyeonseop SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220305725
    Abstract: In a three-dimensional printing method using a three-dimensional printer, a powder material is integrated on a partial area of a bed of the printer. A laser is irradiated to the integrated powder material based on a two-dimensional shape information of a manufactured structure, to sinter a two-dimensional structure and a first wall layer. The integrating and the irradiating are repeated, to form a three-dimensional structure and the first wall layer. The first wall layer is disposed to divide the partial area of the bed into a remaining area of the bed except for the partial area of the bed.
    Type: Application
    Filed: July 30, 2020
    Publication date: September 29, 2022
    Inventors: Changwoo LEE, Taeho HA, Segon HEO, Hyeonseop SHIN, Pil-Ho LEE