Patents by Inventor Hyeonuk YEO

Hyeonuk YEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10280534
    Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: May 7, 2019
    Assignee: Korea Institute of Science and Technology
    Inventors: Munju Goh, Bon-Cheol Ku, Nam Ho You, Sang Jun Youn, Hyeonuk Yeo
  • Publication number: 20190010631
    Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.
    Type: Application
    Filed: September 10, 2018
    Publication date: January 10, 2019
    Applicant: Korea Institute of Science and Technology
    Inventors: Munju GOH, Bon-Cheol KU, Nam Ho YOU, Sang Jun YOUN, Hyeonuk YEO
  • Patent number: 10106421
    Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: October 23, 2018
    Assignee: Korea Institute of Science and Technology
    Inventors: Munju Goh, Nam Ho You, Hyeonuk Yeo, Bon-Cheol Ku, Sang Jun Youn, Jin Won Yu, Jin Jung
  • Patent number: 10059593
    Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: August 28, 2018
    Assignee: Korea Institute of Science and Technology
    Inventors: Munju Goh, Nam Ho You, Hyeonuk Yeo, Bon-Cheol Ku, Sang Jun Youn, Jin Won Yu, Jin Jung
  • Publication number: 20180201835
    Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.
    Type: Application
    Filed: January 9, 2018
    Publication date: July 19, 2018
    Inventors: Munju GOH, Hyeonuk YEO, Nam Ho YOU, Se Gyu JANG, Seokhoon AHN, Young Soo KIM
  • Publication number: 20180194918
    Abstract: Disclosed are a method and an apparatus for repairing composite materials using a solvation process, in which, in the repair of composite materials comprising a matrix resin and a filler fiber, a solution capable of depolymerizing the matrix resin is provided to a portion to be repaired of the composite material to depolymerize the matrix resin. By removing the matrix resin constituting the composite material by solvating it with a solvent while leaving the internal filler fibers, it is possible to secure continuity of the fiber skeleton of the composite material even after the repair, perform very easy repair, and minimize damage to the fiber skeleton.
    Type: Application
    Filed: January 9, 2018
    Publication date: July 12, 2018
    Inventors: Munju GOH, Jun Kyung KIM, Chiyoung PARK, NAM HO YOU, Hyeonuk YEO
  • Patent number: 9950340
    Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: April 24, 2018
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Munju Goh, Nam Ho You, Hyeonuk Yeo, Young Bum Hong
  • Publication number: 20170174523
    Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 22, 2017
    Applicant: Korea Institute of Science and Technology
    Inventors: Munju GOH, Nam Ho YOU, Hyeonuk YEO, Bon-Cheol KU, Sang Jun YOUN, Jin Won YU, Jin JUNG
  • Publication number: 20170165876
    Abstract: Disclosed are a method and an apparatus for recovering a fiber assembly by decomposing a thermosetting resin composite material, such as carbon fiber reinforced plastic (CFRP) in such a manner the fiber assembly used for the thermosetting composite material, such as CFRP, retains its original organizational shape after decomposition, and a fiber assembly recovered by the method.
    Type: Application
    Filed: November 25, 2016
    Publication date: June 15, 2017
    Applicant: Korea Institute of Science and Technology
    Inventors: Munju GOH, Jin JUNG, Jin Won YU, Nam Ho YOU, Hyeonuk YEO, Sang Jun YOUN, Bon-Cheol KU
  • Publication number: 20170096540
    Abstract: Provided are a composition for swelling pretreatment of a cured thermosetting resin material before decomposition, including a surfactant and an acidic material, and a method for swelling pretreatment of a cured thermosetting resin material before decomposition by using the same. When carrying out swelling pretreatment of a cured thermosetting resin material before decomposition by using the composition, it is possible to accelerate infiltration of the acidic material into the cured thermosetting resin material and swelling of the cured thermosetting resin material by virtue of the surfactant, and thus to increase the decomposition reactive surface area. Therefore, it is possible to increase reaction efficiency during the subsequent decomposition process, and to increase the decomposition ratio during the same period of time.
    Type: Application
    Filed: October 3, 2016
    Publication date: April 6, 2017
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Munju GOH, Jin Won YU, Jin JUNG, Sang Jun YOUN, Bon-Cheol KU, Nam Ho YOU, Hyeonuk YEO
  • Publication number: 20170022636
    Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at 200° C., specifically 100° C. or lower, and to reduce a processing cost and an energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.
    Type: Application
    Filed: June 20, 2016
    Publication date: January 26, 2017
    Applicant: Korea Institute of Science and Technology
    Inventors: Munju GOH, Bon-Cheol KU, Nam Ho YOU, Sang Jun YOUN, Hyeonuk YEO
  • Publication number: 20160069069
    Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.
    Type: Application
    Filed: October 21, 2014
    Publication date: March 10, 2016
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Munju GOH, Nam Ho YOU, Hyeonuk YEO, Young Bum HONG
  • Publication number: 20150261021
    Abstract: Disclosed are a liquid crystal film having a reflecting region that changes spontaneously depending on variations in external temperature and light intensity, and a method for manufacturing the same. More particularly, the liquid crystal film has a reflecting region that changes into a visible ray region when the external temperature and light intensity increase and into a near infrared ray region when the external temperature and quality of light decrease.
    Type: Application
    Filed: May 27, 2014
    Publication date: September 17, 2015
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Munju GOH, Nam Ho YOU, Hyeonuk YEO, Seung Hee LEE, Young Bum HONG