Abstract: The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: Disclosed is a copolymer for liquid crystal alignment having a photoreactive group, a mesogen group, a thermosetting group, and a crosslinking group, a liquid crystal aligning layer including the copolymer for liquid crystal alignment, and a liquid crystal display including the liquid crystal aligning layer. Since the liquid crystal aligning layer has excellent thermal stability and no residual image, the liquid crystal aligning layer is usefully applied to the liquid crystal display.

Abstract: The present invention relates to a novel cyclic olefin compound, a polymer including the cyclic olefin compound, a liquid crystal alignment film including the polymer, and a liquid crystal display device including the liquid crystal alignment film. Since the polymer includes the cyclic olefin compound as a main chain, the thermal stability is excellent and the photoreactive speed is high. Accordingly, the production time can be reduced, the production cost can be reduced, and the anchoring force of the liquid crystal can be increased because the alignment property is stabilized due to the curing.

Abstract: A photosensitive resin composition is provided. The photosensitive resin composition comprises a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. The photosensitive resin composition is resistant to heat and can be used to form a pattern whose lateral angles are easily controllable. A large difference in developability between exposed and unexposed portions of the photosensitive resin composition is caused when patterning. The photosensitive resin composition is advantageous in terms of sensitivity, resolution, heat resistance and adhesiveness. Particularly, the lateral angles of the pattern can be easily controlled by varying the contents of the alkali-soluble resins. Therefore, the photosensitive resin composition is useful in the formation of an insulating film pattern of an organic light emitting diode (OLED).

Abstract: Disclosed are an acrylate resin included in a chemically amplified photoresist composition for forming a thick film, a chemically amplified photoresist composition including the same, and a photoresist pattern fabricated therefrom. The photoresist composition including the acrylate resin can achieve an improvement of sensitivity without damaging major characteristics such as compatibility (dispersion stability), spreading characteristics, developing characteristics, and resolution. In addition, a thick resist pattern can be formed with such a composition, and the pattern can have excellent sensitivity, developing characteristics, pattern characteristics, crack resistance, and plating resistance.

Abstract: The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.

Abstract: The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: The present invention relates to a novel cyclic olefin compound, a polymer including the cyclic olefin compound, a liquid crystal alignment film including the polymer, and a liquid crystal display device including the liquid crystal alignment film. Since the polymer includes the cyclic olefin compound as a main chain, the thermal stability is excellent and the photoreactive speed is high. Accordingly, the production time can be reduced, the production cost can be reduced, and the anchoring force of the liquid crystal can be increased because the alignment property is stabilized due to the curing.

Abstract: A block copolymer of a polyimide and a polyamic acid is disclosed. Further disclosed are a method for producing the block copolymer and a positive type photosensitive composition comprising the block copolymer. The solubility of the photosensitive composition in an alkaline aqueous solution is controlled to achieve high resolution of a pattern. Further disclosed are a protective film of a semiconductor device and an ITO insulating film of an organic light emitting diode (OLED), which are formed using the block copolymer. The protective film and the ITO insulating film are very stable over time.

Abstract: The present invention relates to a novel polyimide copolymer, a method of preparing the polyimide copolymer, a liquid crystal aligning layer including the polyimide copolymer, a method of producing the liquid crystal aligning layer, and a liquid crystal display including the liquid crystal aligning layer. The liquid crystal aligning layer that includes the polyimide copolymer according to the present invention is advantageous in that when ultraviolet rays are radiated on movable chains of the polyamic acid copolymer to perform alignment before a polyimide copolymer is imidized and heat treatment is then performed to conduct imidization, thermal stability is excellent, residual images are not formed, and alignment of liquid crystals is excellent.

Abstract: The present invention to a composition for liquid crystal aligning comprising an oligoimide or oligoamic acid, which comprises a thermocurable or photocurable functional group on at least one end of the oligoimide or oligoamic acid backbone, a liquid crystal aligning layer prepared from the same, and a liquid crystal display comprising the same. The composition for liquid crystal aligning according to the present can minimize the generation of the decomposed by-products, which had been generated upon the use of polyimides, by using an oligoimide or oligoamic acid on at least one end of the backbone, instead of the conventional polyimides and has an excellent effect of improvement in alignment property, thermal stability, and image sticking.

Abstract: The present invention provides an acrylic pressure-sensitive adhesive composition for a polarizing film comprising a) 100 parts by weight of a (meth)acrylic copolymer having a high molecular weight, which is copolymerized from a (meth)acrylic acid ester monomer and a vinylic and/or an acrylic monomer having a functional group capable of crosslinking with a multifunctional crosslinking agent and has a weight-average molecular weight of at least 1,000,000; b) 5-20 parts by weight of a (meth)acrylic copolymer having a low molecular weight, which comprises the same monomer of the main chain of a) the (meth)acrylic copolymer having a high molecular weight, has a weight-average molecular weight of 2,000-30,000 and comprises 0.01-1 monomer, per one molecule of the copolymer on average, having a functional group capable of reacting with the crosslinking agent of c); and c) 0.01-10 parts by weight of a multifunctional crosslinking agent.

Abstract: The present invention relates to a novel silane coupling agent represented by Formula 1 below and a method for manufacturing the same. Because the compound has urethane and pyridine functional groups, it has superior storage stability and good adhesion property to a matrix resin having hydroxy groups, and thus can be used in a variety of applications. where each of R1 and R2 is hydrogen or C1-C3 alkyl, a is an integer from 0 to 3, each of R3, R4, R5 and R6 is hydrogen, C1-C10 alkyl, halogen, trifluoroalkyl or alkoxyalkyl and n is an integer from 1 to 3.

Abstract: The present invention relates to an acrylic pressure sensitive adhesive composition containing organic functional groups of urethane and pyridine, more precisely an acrylic pressure sensitive adhesive composition which has excellent removability owing to its low initial peel strength on glass and excellent long-term durability since the peel strength of the pressure sensitive adhesive composition onto glass is being increased under high temperature and high humidity. The present invention also relates to an acrylic pressure sensitive adhesive composition for a polarizer having excellent adhesive functions and durability, a polarizer and a LCD containing the same.

Abstract: Provided is an acrylic pressure-sensitive adhesive composition for a polarizing film comprising an acrylic copolymer copolymerized from (meth)acrylic ester monomers having different glass transition temperatures. The acrylic pressure-sensitive adhesive composition of the present invention can minimize the problem of light leakage due to shrinkage or expansion of a polarizing film attached to a liquid crystal display panel because it has very superior stress relaxation ability while maintaining superior major properties such as adhesion durability, cuttability, etc.