Abstract: The present invention provides a piezoelectric speaker and a vibration module for a panel speaker including a piezoelectric speaker and a vibration module for a panel speaker including one speaker unit being configured by including a diaphragm, and at least 3 piezoelectric resonators each being independently configured and attached to one surface of the diaphragm. As described above, according to the present invention, the acoustic properties of a piezoelectric speaker having the advantages of a thin speaker may be enhanced. Most particularly, the present invention may provide a piezoelectric speaker that is required in panel speakers of large-sized TVs, mobile devices, and so on, that can generate sufficient sound pressure and produce stable bass sound (or low frequency sound) at the same time, by resolving the disadvantages of insufficient sound pressure properties in the low frequency band, and by enhancing the smoothness of the sound pressure level (SPL).

Abstract: A piezoelectric generator for power supply of a portable terminal is provided. The piezoelectric generator includes: a portable terminal case which has a battery mounting part formed on one surface thereof and has parts of the portable terminal mounted therein; a slide part which is formed on opposite side surfaces of a border of the portable terminal case to be able to slide up and down; and a piezoelectric body which has one end or opposite ends connected with the slide part and is disposed in the battery mounting part in a transverse direction, and which vibrates by a sliding movement of the slide part.

Abstract: A piezoelectric generator for power supply of a portable terminal is provided. The piezoelectric generator includes: a portable terminal case which has a battery mounting part formed on one surface thereof and has parts of the portable terminal mounted therein; a slide part which is formed on opposite side surfaces of a border of the portable terminal case to be able to slide up and down; and a piezoelectric body which has one end or opposite ends connected with the slide part and is disposed in the battery mounting part in a transverse direction, and which vibrates by a sliding movement of the slide part.

Abstract: A piezoelectric power generator can be used regardless of the size of the parts, and can position the mass center of a mass at the center by disposing the free ends of cantilevers opposite each other when connecting a plurality of cantilevers in series. The piezoelectric power generator is a morph structure cantilever piezoelectric power generator having at least two cantilevers disposed with their free ends opposite to each other, and a mass that is one body provided for bending of the cantilevers.

Abstract: A piezoelectric power generator for feeding emergency power, includes a frame; a fixing unit comprising a left fixing body coupled to an upper left side of the frame and a right fixing body coupled to an upper right part of the frame; a first piezoelectric body bonded to a right side of the left fixing body; a second piezoelectric body bonded to a left side of the right fixing body; and a vibration unit bonded between the first piezoelectric body and the second piezoelectric body and vibrating vertically.

Abstract: A piezoelectric power generator for feeding emergency power, includes a frame; a fixing unit comprising a left fixing body coupled to an upper left side of the frame and a right fixing body coupled to an upper right part of the frame; a first piezoelectric body bonded to a right side of the left fixing body; a second piezoelectric body bonded to a left side of the right fixing body; and a vibration unit bonded between the first piezoelectric body and the second piezoelectric body and vibrating vertically.

Abstract: This invention is about a Ceramic Heater which comprises a built-in heating unit circuit and a built-in separate temperature sensor circuit, wherein precision circuit printing technology and layering technology are used, and which is manufactured by means of cofiring process. This invention is featured by a first circuit board, a heating circuit in certain patterns on the top side of the aforesaid first board, a sensor circuit positioned between the patterns of the heating circuit, and a second board which is layered over the aforesaid first board.

Abstract: The present invention relates to a package structure which is formed by coupling a sintered ceramic base substrate to a ceramic frame, and a sensor module using the package structure. The package structure comprises a frame made of ceramic or plastic material, a groove being formed at an end portion of the frame on the sintered ceramic substrate side; one or more sintered ceramic substrates provided with electrodes; and a bonding means made of glass material or organic bonding material, for bonding the sintered ceramic substrate and the frame.

Abstract: Disclosed is a semiconductor device having a capacitor of large capacitance. The capacitor includes a first electrode portion which has a conductive structure formed on a semiconductor substrate, an insulating layer with pinholes in the conductive structure, and a conductive silicon layer grown through the pinholes, a second electrode portion on the first electrode portion, and a dielectric film formed between the first and second electrode portions. A method for manufacturing the device includes the steps of forming the first electrode portion by forming the conductive structure, forming the insulating layer, growing a silicon through the pinholes to form a conductive silicon layer, and forming the dielectric film and the second electrode portion. The capacitor can be formed with various shapes and is increased to 1.5 times or greater in capacitance while maintaining reliability comparable to that of a conventional one.

Abstract: Disclosed is a semiconductor device having a capacitor of large capacitance. The capacitor includes a first electrode portion which has a conductive structure formed on a semiconductor substrate, an insulating layer with pinholes in the conductive structure, and a conductive silicon layer grown through the pinholes, a second electrode portion on the first electrode portion, and a dielectric film formed between the first and second electrode portions. A method for manufacturing the device includes the steps of forming the first electrode portion by forming the conductive structure, forming the insulating layer, growing a silicon through the pinholes to form a conductive silicon layer, and forming the dielectric film and the second electrode portion. The capacitor can be formed with various shapes and is increased to 1.5 times or greater in capacitance while maintaining reliability comparable to that of a conventional one.