Abstract: A system and method adapted to detect a malfunction related to a pad conditioner in a polishing apparatus are disclosed. The pad conditioner includes a conditioning pad seated on a conditioner head and a drive motor rotating the conditioner head. The system also comprises a current sensor connected to the drive motor, adapted to detect electrical current drawn by the drive motor, and provide a corresponding current value, a Personal Computer (PC) receiving the current value, adapted to compare the received current value to first and second reference values, and generate a drive indication signal in response to the comparison, and a main controller receiving the drive indication signal and adapted to generate an interlock signal halting operation of the polishing apparatus in response to the drive indication signal.

Abstract: A system and method adapted to detect a malfunction related to a pad conditioner in a polishing apparatus are disclosed. The pad conditioner includes a conditioning pad seated on a conditioner head and a drive motor rotating the conditioner head. The system also comprises a current sensor connected to the drive motor, adapted to detect electrical current drawn by the drive motor, and provide a corresponding current value, a Personal Computer (PC) receiving the current value, adapted to compare the received current value to first and second reference values, and generate a drive indication signal in response to the comparison, and a main controller receiving the drive indication signal and adapted to generate an interlock signal halting operation of the polishing apparatus in response to the drive indication signal.

Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing pad, a platen, and a cleaning apparatus which provides a cleaning fluid for cleaning the polishing head. The cleaning apparatus includes a shaft located outside a periphery of the polishing pad, and an arm mounted to the shaft and extending over the polishing pad such that a bottom surface of the arm confronts the polishing surface of the polishing pad. Further, a cleaning fluid path is defined in the arm along a length of the arm, and first drop holes are defined in the arm which are fluidly connected to the cleaning fluid path and which drop cleaning fluid onto the polishing surface of the polishing pad.

Abstract: A wafer planarizing apparatus includes a cleaner that prevents contamination caused by a fume phenomenon occurring when slurry is cleaned from a base of a polishing station. The cleaner has spout holes through which a cleaning solution is applied to a side of a platen of the polishing station. As the cleaning solution flows along the side of the platen, the side of the platen is cleaned. Beneficially, a main body of the cleaner has an arch-shaped upper side so as to stream down foreign materials.