Patents by Inventor Hyeung Wook PARK

Hyeung Wook PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9714113
    Abstract: The reusable packaging box includes a bottom unit that has a receiving space in which a product may be received, a lower body and an upper body that are provided to each have a box shape with open top and bottom to be coupled to a top of the bottom unit, and a lid that has a receiving space in which the product may be received and is coupled to the top of the upper body. Each of the bottom unit, the upper body and the lower body, and the lid is formed of a material that may absorb an impact and thus may perform both a function of absorbing an impact and a function of packaging an outside of the product.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: July 25, 2017
    Assignee: SAMSUNG ELECTRONICS CO., Ltd.
    Inventors: Byung Min Jung, Hyeung Wook Park, Jong Deok Lim, Yong Seok Choi, Ah-Young Kim, Choul Jun Hwang
  • Publication number: 20130277263
    Abstract: The reusable packaging box includes a bottom unit that has a receiving space in which a product may be received, a lower body and an upper body that are provided to each have a box shape with open top and bottom to be coupled to a top of the bottom unit, and a lid that has a receiving space in which the product may be received and is coupled to the top of the upper body. Each of the bottom unit, the upper body and the lower body, and the lid is formed of a material that may absorb an impact and thus may perform both a function of absorbing an impact and a function of packaging an outside of the product.
    Type: Application
    Filed: April 23, 2013
    Publication date: October 24, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung Min JUNG, Hyeung Wook PARK, Jong Deok LIM, Yong Seok CHOI