Abstract: A semiconductor package includes a semiconductor, a passive component disposed in parallel with the semiconductor chip and having a connection electrode, and a connection structure on a lower surface of the passive component. The connection structure includes a first metal layer electrically connected to the connection electrode, a second metal layer on the same level as the first metal layer and disposed adjacent to the first metal layer, and a wiring insulating layer having an insulating region filling the first and second metal layers and extending in one direction. A minimum width of the insulating region is referred to as a first width, and a shortest distance between one end of the passive component and one end of the insulating region on the same level is referred to as a spacing distance, and the spacing distance may be twice or more than the first width.