Abstract: In accordance with the present invention, there is provided a semiconductor package or device including a uniquely configured leadframe sized and configured to maximize the available number of exposed lands or I/O's in the semiconductor device. More particularly, the semiconductor device of the present invention includes a die pad (or die paddle) defining multiple peripheral edge segments. In addition, the semiconductor device includes a plurality of lands which are provided in a prescribed arrangement. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the lands. At least portions of the die pad, the lands, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and the lands being exposed in a common exterior surface of the package body.