Patents by Inventor Hyo Bum Kang

Hyo Bum Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chuck stage particle detection device
    Patent number: 10825703
    Abstract: A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mu Yer Lee, Hyo Bum Kang, Jun Sung Lee, Jae Lyang Jung, Young Min Hur
  • CHUCK STAGE PARTICLE DETECTION DEVICE
    Publication number: 20180323094
    Abstract: A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.
    Type: Application
    Filed: January 10, 2018
    Publication date: November 8, 2018
    Inventors: MU YER LEE, Hyo Bum Kang, Jun Sung Lee, Jae Lyang Jung, Young Min Hur