Patents by Inventor Hyo Chang Yun
Hyo Chang Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240124684Abstract: A novel additive comprising an oxamide additive with long chains is described herein. The additive can be incorporated into a thermoplastic polymer to form a thermoplastic polymer composite. The additive modifies the surface of the thermoplastic polymer to render the oil, water or dust repellent properties to the thermoplastic polymer composite.Type: ApplicationFiled: September 7, 2023Publication date: April 18, 2024Applicant: TE Connectivity Solutions GmbHInventors: Lei WANG, Ting GAO, Dejie TAO, Hyo Chang YUN
-
Patent number: 9954291Abstract: An electrical device includes first and second terminals and a terminal holder holding the first and second terminals. A first insulation layer is provided between the first and second terminals and a second insulation layer is provided between the first and second terminals. The first and second insulation layers are different materials. The first insulation layer is a base layer and the second insulation layer is a high arc tracking resistance rated layer on the base layer to discourage arc tracking on the first insulation layer.Type: GrantFiled: June 6, 2016Date of Patent: April 24, 2018Assignee: TE CONNECTIVITY CORPORATIONInventors: Lei Wang, Hyo Chang Yun, Peter J. Dutton
-
Publication number: 20170352966Abstract: An electrical device includes first and second terminals and a terminal holder holding the first and second terminals. A first insulation layer is provided between the first and second terminals and a second insulation layer is provided between the first and second terminals. The first and second insulation layers are different materials. The first insulation layer is a base layer and the second insulation layer is a high arc tracking resistance rated layer on the base layer to discourage arc tracking on the first insulation layer.Type: ApplicationFiled: June 6, 2016Publication date: December 7, 2017Inventors: Lei Wang, Hyo Chang Yun, Peter J. Dutton
-
Publication number: 20170271745Abstract: An antenna cover for an antenna of an aircraft includes a thermal barrier having an aerogel blanket having a shape of the antenna cover. The aerogel blanket has an inner side and an outer side with edges therebetween. The inner side is configured to face the antenna. The antenna cover includes a cover layer applied to the aerogel blanket. The cover layer includes at least one polytetrafluoroethylene (PTFE) sheet being a structurally reinforcing layer affixed to the outer side of the aerogel blanket to provide rigidity to the aerogel blanket.Type: ApplicationFiled: March 17, 2016Publication date: September 21, 2017Inventors: Hyo Chang Yun, Kathleen Fasenfest, Thomas D. Ratzlaff, Lei Wang, Ismael L. Sandoval
-
Publication number: 20170245380Abstract: A thermal barrier for an electronic component includes an aerogel blanket configured to cover at least a portion of the electronic component and a cover positioned between the aerogel blanket and the electronic component. The aerogel blanket has a top, a bottom and edges therebetween. The bottom is configured to face the electronic component. The cover is a structurally reinforcing fabric affixed to the bottom of the aerogel blanket. The cover inhibits dust migration from the aerogel blanket toward the electronic component.Type: ApplicationFiled: February 18, 2016Publication date: August 24, 2017Inventors: Hyo Chang Yun, Thomas D. Ratzlaff, Ismael L. Sandoval, David A. Hurrell, Bruce R. Conway, Peter J. Dutton
-
Publication number: 20170226389Abstract: An adhesive arrangement includes an adhesive formed from an adhesive composition, the adhesive composition having a fluoropolymeric material, a functionalized fluoropolymeric material, and a thermoplastic material, and a base layer in contact with the adhesive, the base layer being a perfluoropolymeric material, a composite material, a metal material, or a metallic material. The thermoplastic material is selected from the group consisting of polyamide (PA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polyimide (PI), polyimide derivatives such as polyetherimide (PEI), polyaryletherketone (PAEK), polyaryletherketone derivatives, polysulfone, polyethersulfone (PES), polysulfone derivatives, and combinations thereof.Type: ApplicationFiled: February 10, 2016Publication date: August 10, 2017Applicant: Tyco Electronics CorporationInventors: Lei Wang, Hyo Chang Yun, Peter J. Dutton
-
Publication number: 20160268016Abstract: Static dissipative articles and processes of producing static dissipative articles are described. The static dissipative article includes a conductor and a dissipative coating over the conductor, the dissipative coating including a polymer matrix and between 0.1 and 10%, by weight, conductive nano-carbons homogenously distributed with the polymer matrix. The dissipative coating has a resistivity of between 106 and 1014 ohm·cm, and the conductive-nano-carbons have an aspect ratio of at least 100. The process of producing a coated article includes blending a polymer powder with between 0.1 and 10%, by weight, conductive nano-carbons to form a micron-level homogenous compound, and extruding the compound onto a conductor to form a dissipative coating over the conductor.Type: ApplicationFiled: March 13, 2015Publication date: September 15, 2016Applicant: Tyco Electronics CorporationInventors: Hyo Chang Yun, Lei Wang, Peter J. Dutton
-
Patent number: 9392708Abstract: An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit includes a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure.Type: GrantFiled: April 4, 2014Date of Patent: July 12, 2016Assignee: TYCO ELECTRONICS CORPORATIONInventors: Bruce R. Conway, Hyo Chang Yun, Peter J. Dutton, Thomas D. Ratzlaff, Paul Craig Tally, James O'Keeffe, Erling Hansen
-
Patent number: 9382038Abstract: An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure.Type: GrantFiled: April 4, 2014Date of Patent: July 5, 2016Assignee: TYCO ELECTRONICS CORPORATIONInventors: Bruce R. Conway, Hyo Chang Yun, Peter J. Dutton, Thomas D. Ratzlaff, Paul Craig Tally, James O'Keeffe, Erling Hansen
-
Publication number: 20160160090Abstract: An adhesive arrangement includes an adhesive formed from an adhesive composition having a thermoplastic material and a melt-processable perfluoropolymeric material. The adhesive arrangement further includes a base layer in contact with the adhesive. The thermoplastic material is polyetherimide (PEI), polyphenylenesulfide (PPS), polyaryletherketone (PAEK) including polyetheretherketone (PEEK), polyamide (PA), and/or polysulfone derivatives including polysulfone. The base layer is a perfluoropolymeric material, a composite material, a metal material, a metallic material, another suitable material, or a combination thereof.Type: ApplicationFiled: December 4, 2014Publication date: June 9, 2016Applicant: Tyco Electronics CorporationInventors: Lei Wang, Hyo Chang Yun, Peter J. Dutton
-
Publication number: 20150289388Abstract: An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit comprises a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure.Type: ApplicationFiled: April 4, 2014Publication date: October 8, 2015Applicant: Tyco Electronics CorporationInventors: Bruce R. Conway, Hyo Chang Yun, Peter J. Dutton, Thomas D. Ratzlaff, Paul Craig Tally, James O'Keeffe, Erling Hansen
-
Publication number: 20150289389Abstract: An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure.Type: ApplicationFiled: April 4, 2014Publication date: October 8, 2015Applicant: Tyco Electronics CorporationInventors: Bruce R. Conway, Hyo Chang Yun, Peter J. Dutton, Thomas D. Ratzlaff, Paul Craig Tally, James O'Keeffe, Erling Hansen
-
Publication number: 20150056444Abstract: An adhesive manufacturing process, an adhesive, and an article are disclosed. The adhesive manufacturing process includes blending a lower-melt fluoropolymer having a melting point that is less than a first temperature with a fluoropolymer powder having a melting point that is greater than a second temperature to form an adhesive and applying the adhesive to a surface at the first temperature. The adhesive is configured to be exposed to the second temperature. The adhesive includes the lower-melt fluoropolymer and the fluoropolymer powder blended with the lower-melt fluoropolymer. The article includes a surface and the adhesive applied to the surface at an applying temperature.Type: ApplicationFiled: August 26, 2013Publication date: February 26, 2015Applicant: Tyco Electronics CorporationInventors: Lei Wang, Hyo Chang Yun
-
Publication number: 20150056443Abstract: An adhesive composition blend and an article are disclosed. The adhesive composition blend includes a higher-melt fluoropolymer component having a melting point greater than a predetermined maximum service temperature and a lower-melt fluoropolymer component having a melting point less than a predetermined applying temperature. The melting point of the higher-melt fluoropolymer is at least 20° C. greater than the melting point of the lower-melt fluoropolymer. Additionally or alternatively, the adhesive composition blend includes a higher-melt fluoropolymer component having a melting point between about 200° C. and about 330° C. and a lower-melt fluoropolymer component having a melting point between about 100° C. and about 260° C. The article includes a substrate and the adhesive.Type: ApplicationFiled: August 26, 2013Publication date: February 26, 2015Applicant: Tyco Electronics CorporationInventors: Lei Wang, Hyo Chang Yun, David A. Hurrell