Abstract: The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof.

Abstract: The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.

Abstract: A light emitting device apparatus is provided. For example, a light emitting device package include a substrate, a light emitting device, a reflection molding member, an upper cover and an interval maintaining part. The substrate includes a first electrode and a second electrode. The light emitting device includes a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode. The reflection molding member includes a form and a reflection cup part. The upper cover is formed in a shale corresponding to that of an upper surface of the reflection molding member, and the interval maintaining part is formed at the upper cover such that a predetermined optical interval is maintained between a light guide plate and the light emitting device.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.