Patents by Inventor Hyo Jung Noh

Hyo Jung Noh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978893
    Abstract: A cathode active material for a lithium secondary battery includes a lithium metal oxide particle and a thio-based compound formed on at least portion of a surface of the lithium metal oxide particle. The thio-based compound has a double bond that contains a sulfur atom. Chemical stability of the lithium metal oxide particle may be improved and surface residues may be reduced by the thio-based compound.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: May 7, 2024
    Assignee: SK ON CO., LTD.
    Inventors: Jik Soo Kim, Sang Bok Kim, Hyo Shin Kwak, Myoung Lae Kim, Se Rah Moon, Jin Seok Seo, Mi Jung Noh, Duck Chul Hwang
  • Patent number: 11111579
    Abstract: A deposition equipment is provided. The deposition equipment includes: a reaction chamber including an upper plate and a container body, the upper plate including a gas supplier for injecting a processing gas; a wafer chuck including an upper surface on which a wafer is loaded, in the reaction chamber, with the upper surface of the wafer chuck facing the upper plate; and a processing gas shielding section which prevents the processing gas from being adsorbed to the upper surface of the wafer chuck and is disposed between the upper plate and the wafer chuck in a state in which the wafer is removed from the wafer chuck. The processing gas shielding section includes a shutter which is plate-like, and the shutter includes a region including a gas discharge section for jetting a purging gas toward the wafer chuck.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: September 7, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun Yong Hwang, Hyun Su Kim, Eun-Ok Lee, Taek Jung Kim, Hyo Jung Noh, Ji Won Yu
  • Publication number: 20190345606
    Abstract: A deposition equipment is provided. The deposition equipment includes: a reaction chamber including an upper plate and a container body, the upper plate including a gas supplier for injecting a processing gas; a wafer chuck including an upper surface on which a wafer is loaded, in the reaction chamber, with the upper surface of the wafer chuck facing the upper plate; and a processing gas shielding section which prevents the processing gas from being adsorbed to the upper surface of the wafer chuck and is disposed between the upper plate and the wafer chuck in a state in which the wafer is removed from the wafer chuck. The processing gas shielding section includes a shutter which is plate-like, and the shutter includes a region including a gas discharge section for jetting a purging gas toward the wafer chuck.
    Type: Application
    Filed: April 17, 2019
    Publication date: November 14, 2019
    Inventors: Sun Yong Hwang, Hyun Su Kim, Eun-Ok Lee, Taek Jung Kim, Hyo Jung Noh, Ji Won Yu