Patents by Inventor Hyo S. No

Hyo S. No has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module housing and assembly with integral heatsink
    Patent number: 5212627
    Abstract: An electronic module housing (30) with an integral heatsink (32) is provided as part of an electronic module assembly (31). The heatsink (32) has a general U-shape formed by a pair of opposing sidewalls (33, 34) rising upward from a central intermediate portion (37) having a planar surface (38) for mounting a module substrate thereon. Plastic housing material is molded about the heatsink so as to form an interior module receiving cavity (50). The cavity is generally defined by the heatsink sidewalls (33, 34) and a pair of molded plastic opposing sidewalls (55, 56) provided between the heatsink sidewalls. Preferably heat conductive mounting ear portions (40, 41) extend from ends (43, 44) of the heatsink sidewalls and permit thermally mounting the housing to another heatsinking structure. Preferably molded interior plastic sidewalls (57, 58) separate the heatsink sidewalls (33, 34) from the cavity (50).
    Type: Grant
    Filed: January 31, 1992
    Date of Patent: May 18, 1993
    Assignee: Motorola, Inc.
    Inventor: Hyo S. No