Abstract: Disclosed is an overlay measurement apparatus which may include: a light source unit configured to direct an illumination to an overlay measurement target formed in a wafer; a lens unit having an objective lens and a lens focus actuator; a detection unit acquiring a focus image at a measurement position; a stage on which the wafer is seated; and a control unit controlling the lens unit to acquire the overlay measurement target, processing a first sample image of the overlay measurement target detected by the detection unit and a second sample image rotated at 180 degrees based on the first sample image and detected, and calculating a difference between the processed images to calculate the difference as a correction image for correcting an image for which overlay is measured.

Abstract: There is provided an overlay measurement device controlling a focus movement, which includes: a lighting part being configured to orient lighting toward an overlay measurement target; a collection part comprising an objective lens and a detector for obtaining one or more of images of each focus in the overlay measurement target; a lens focus actuator moving the objective lens to adjust a distance between the objective lens and a wafer; and a processor controlling an operation of the lens focus actuator. The processor obtains a focus graph respectively in relation to two layers from one or more of the images of each focus, and the processor identifies a reference focus in relation to the obtained focus graphs to move the objective lens.

Abstract: There is provided an overlay measurement device controlling a focus movement, which includes: a lighting part being configured to orient lighting toward an overlay measurement target; a collection part comprising an objective lens and a detector for obtaining one or more of images of each focus in the overlay measurement target; a lens focus actuator moving the objective lens to adjust a distance between the objective lens and a wafer; and a processor controlling an operation of the lens focus actuator. The processor obtains a focus graph respectively in relation to two layers from one or more of the images of each focus, and the processor identifies a reference focus in relation to the obtained focus graphs to move the objective lens.

Abstract: There is provided a deep learning-based overlay key centering system and a method thereof that may precisely measure and examine an alignment state of fine patterns of a semiconductor substrate. The method includes collecting an input data set from at least one device, the input data set comprising measurement image data of an overlay key and label data including information on a position and bounding box size of the overlay; and training the model by inputting the input data set to a model for deep learning. The step of training the model may include a step of calculating a loss function by comparing result data predicted by the model with the label data; and a step of optimizing an algorithm of the model by modifying a weight of the model so that a loss value calculated with the loss function may become smaller than a reference value.

Abstract: There is provided a deep learning-based overlay key centering system and a method thereof that may precisely measure and examine an alignment state of fine patterns of a semiconductor substrate. The method includes collecting an input data set from at least one device, the input data set comprising measurement image data of an overlay key and label data including information on a position and bounding box size of the overlay; and training the model by inputting the input data set to a model for deep learning. The step of training the model may include a step of calculating a loss function by comparing result data predicted by the model with the label data; and a step of optimizing an algorithm of the model by modifying a weight of the model so that a loss value calculated with the loss function may become smaller than a reference value.

Abstract: There is provided an overlay measurement device controlling a focus movement, which includes: a lighting part being configured to orient lighting toward an overlay measurement target; a collection part comprising an objective lens and a detector for obtaining one or more of images of each focus in the overlay measurement target; a lens focus actuator moving the objective lens to adjust a distance between the objective lens and a wafer; and a processor controlling an operation of the lens focus actuator. The processor obtains a focus graph respectively in relation to two layers from one or more of the images of each focus, and the processor identifies a reference focus in relation to the obtained focus graphs to move the objective lens.

Abstract: The present invention provide a filler metal for TIG welding capable of stable welding, of which heat flux feeding area is wider than conventional wire filler metal and heat input per unit length is increased. The filler metal for TIG welding which is continuously supplied on a base metal to be melted by an arc after forming the arc between the base metal and an electrode over the base metal and supplying shield gas around the arc, wherein the cross-section of the filler metal has curved shape of which surface facing the electrode is concavely curved to the electrode.

Abstract: The present invention provide a filler metal for TIG welding capable of stable welding, of which heat flux feeding area is wider than conventional wire filler metal and heat input per unit length is increased.

Abstract: The present invention provide a filler metal for TIG welding capable of stable welding, of which heat flux feeding area is wider than conventional wire filler metal and heat input per unit length is increased.