Patents by Inventor Hyo Sik YANG

Hyo Sik YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170304
    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes treating modules having an opening for taking in and taking out a substrate and which are stacked on each other; and an air flow generating member for generating a downward airflow at each treating module, and wherein the air flow generating member includes: a pan unit configured to supply an air; a spray unit configured to be provided above the treating module and which sprays an air supplied from the pan unit; and an exhaust unit configured to exhaust an air sprayed by the spray unit to outside of the treating module.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 23, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Ho Jong HWANG, Hyun Goo PARK, Hyo Won YANG, Ki-Moon KANG, Sang Min LEE, Se Hoon OH, Won Sik SON
  • Publication number: 20160098023
    Abstract: The present invention relates to an UML unification model system, in particular to a system for metamodeling transformation to guarantee interoperability between an UML model of IEC 61850 and an UML model of IEC 61970. According to the invention, all IEC 61970 smart grid application using IEC 61850 data source easily obtains interoperability between applications and actively react to change of international standard because application developers use data by referring to a single UML IEC 61850/61970 unified model and refer to a single UML model reflecting flexibly constant modification of IEC standard, if any.
    Type: Application
    Filed: February 24, 2014
    Publication date: April 7, 2016
    Applicant: MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COOPERATION FOUNDATION
    Inventors: Hyuk Soo JANG, Hyo Sik YANG, Seok Yeol YUN, Dae Kyoo Kim, Herbert FALK, Dae-Seung HONG, Sangsig KIM, Byunghun LEE
  • Publication number: 20160092604
    Abstract: The present invention relates to a method for metamodeling unification, in particular to a method for metamodeling unification to guarantee interoperability between an UML model of IEC 61850 and an UML model of IEC 61970. According to the invention, all IEC 61970 smart grid application using IEC 61850 data source easily obtains interoperability between applications and actively react to change of international standard because application developers use data by referring to a single UML IEC 61850/61970 unified model and refer to a single UML model reflecting flexibly constant modification of IEC standard, if any.
    Type: Application
    Filed: February 24, 2014
    Publication date: March 31, 2016
    Applicant: MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COOPERATION FOUNDATION
    Inventors: Hyuk Soo JANG, Hyo Sik YANG, Seok Yeol YUN, Dae Kyoo KIM, Herbert FALK, Dae-Seung HONG, Sangsig KIM, Byunghun LEE
  • Publication number: 20150317127
    Abstract: The present invention relates to a metamodeling unification system, in particular to a system for metamodeling unification to guarantee interoperability between an UML model of IEC 61850 and an UML model of IEC 61970. According to the invention, all IEC 61970 smart grid application using IEC 61850 data source easily obtains interoperability between applications and actively react to change of international standard because application developers use data by referring to a single UML IEC 61850/61970 unified model and refer to a single UML model reflecting flexibly constant modification of IEC standard, if any.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 5, 2015
    Applicant: MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COORPERATION FOUNDATION
    Inventors: Hyuk Soo JANG, Hyo Sik YANG, Seok Yeol YUN, Dae Kyoo KIM, Herbert FALK, Dae-Seung HONG, Sangsig KIM, Byunghun LEE