Abstract: The present invention relates to antibody-drug conjugates (ADCs) wherein a plurality of active agents are conjugated to an antibody through at least one branched linker. The branched linker may comprise a branching unit, and two active agents are coupled to the branching unit through a secondary linker and the branching unit is coupled to the antibody by a primary linker. The active agents may be the same or different. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g., 2-4 branched linkers, which may each be coupled to a different C-terminal cysteine of a heavy or light chain of the antibody. The branched linker may comprise one active agent coupled to the branching unit by a first branch and a second branch that comprises a polyethylene glycol moiety coupled to the branching unit. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g.

Abstract: A display device includes a first region, a second region adjacent to a side of the first region, and a third region adjacent to another side of the first region; a display panel in the first region, the second region and the third region; a window on and overlapping the display panel; and a bonding member between the display panel and the window and in the first region, the second region and the third region. The bonding member includes a first bonding part having a first elastic modulus and in the first region, a second bonding part having a second elastic modulus and in the second region, and a third bonding part having a third elastic modulus and in the third region. The first elastic modulus is greater than each of the second elastic modulus and the third elastic modulus.

Abstract: The present invention provides a multilayer circuit board and a method for manufacturing the same for improving a bowing problem that occurs when manufacturing the multilayer circuit board. A multilayer circuit board according to the present invention is a board having a patterned layer that functions as a circuit a base layer, and includes: a second pattern layer formed on one side of the base layer; a first pattern layer formed on the second pattern layer; and an interlayer insulating layer formed between the first pattern layer and the second pattern layer, the interlayer insulating layer being partially formed on the second pattern layer so as to correspond to a region where the first pattern layer is formed.

Abstract: A pixel includes: a storage capacitor connected between a first power supply voltage and a gate node; a first transistor including a gate electrode connected to the gate node; a second transistor to transfer a data signal to a source of the first transistor in response to a scan signal; a third transistor to diode-connect the first transistor in response to the scan signal, and including first and second sub-transistors serially connected between the gate node and a drain of the first transistor; a fourth transistor to transfer an initialization voltage to the gate node in response to an initialization signal, and including third and fourth sub-transistors serially connected between the gate node and the initialization voltage; and an organic light emitting diode including a cathode connected to a second power supply voltage. At least one of the second and fourth sub-transistors includes a bottom electrode.

Abstract: A color conversion panel includes a first color filter and a second color filter that are disposed on a substrate, a low refractive index layer disposed on the substrate, the first color filter, and the second color filter, the low refractive index layer including at least one of a first blue pigment and a first blue dye, a first color conversion layer overlapping the first color filter and including a semiconductor nanocrystal, a second color conversion layer overlapping the second color filter and including a semiconductor nanocrystal, and a transmissive layer that overlaps the low refractive index layer.

Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.

Abstract: According to an embodiment of the present invention, in order to perform fine particle agglomeration by outputting a low frequency sound wave and then remove fine particles, there is provided a method for fine particle agglomeration, the method including: an initial fine particle measuring step of generating fine particle measurement data including a pollution level of fine particles in a purification region and outputting the data to a sound source converting unit, by a fine particle measuring unit; a low frequency and sound pressure data extracting step of extracting a low frequency and sound pressure of a low frequency sound source stored in a storage to be used for agglomeration of fine particles, based on the fine particle measurement data, by the sound source converting unit; a sound source converting step of converting an output sound source into the low frequency sound source such that the low frequency sound source has the extracted low frequency and sound pressure data, by the sound source convertin

Abstract: Disclosed herein is a colored metal that includes a metal substrate containing a first metal, an oxidation degree control pattern positioned on the metal substrate, and increasing or decreasing a degree of oxidation of the first metal over time, and a coating film positioned on the metal substrate where the oxidation degree control pattern is positioned, wherein a first region of the metal substrate where the oxidation degree control pattern is present thereon and a second region of the metal substrate where the oxidation degree control pattern is not present thereon exhibit different colors due to a difference in degree of oxidation over time.

Abstract: The present invention relates to a method for analyzing the color of a color alloy and, more particularly, to a method for analyzing the color of a color alloy wherein, on the basis of the fact that a different color appears according to the composition of an alloy, the wavelength-wise reflectance related to a color, which is held according to each alloy composition, and that related to a color, which is held by a measurement object that is to be measured, are compared, thereby determining the color held by the measurement object.

Abstract: The present invention relates to a method for analyzing the color of a color alloy and, more particularly, to a method for analyzing the color of a color alloy wherein, on the basis of the fact that a different color appears according to the composition of an alloy, the wavelength-wise reflectance related to a color, which is held according to each alloy composition, and that related to a color, which is held by a measurement object that is to be measured, are compared, thereby determining the color held by the measurement object.

Abstract: A ball grid array (BGA) package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. In the BGA package, the plating line is cut to form a predetermined uneven bonding pad using half-etching, thereby increasing the contact area between the bonding pad and a solder ball. The BGA package includes a first external layer having a first circuit pattern and a wire bonding pad pattern wherein a chip is connected to a wire bonding pad using wire bonding. A second external layer includes a second circuit pattern, a cut plating line pattern, and a half-etched uneven solder ball pad pattern. In the second external layer, another chip is mounted on a solder ball pad. An insulating layer having a through hole interposed between the first and second external layers and electrically connects the first and second external layers therethrough.

Abstract: A ball grid array (BGA) package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. In the BGA package, the plating line is cut to form a predetermined uneven bonding pad using half-etching, thereby increasing the contact area between the bonding pad and a solder ball. The BGA package includes a first external layer having a first circuit pattern and a wire bonding pad pattern wherein a chip is connected to a wire bonding pad using wire bonding. A second external layer includes a second circuit pattern, a cut plating line pattern, and a half-etched uneven solder ball pad pattern. In the second external layer, another chip is mounted on a solder ball pad. An insulating layer having a through hole interposed between the first and second external layers and electrically connects the first and second external layers therethrough.

Abstract: In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a periphery. With this bent structure of the dish configuration, the bonding pad provides an increased bonding area for the solder, so that the BGA package substrate is enhanced in reliability.

Abstract: A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.

Abstract: A system for and a method of analyzing the surface condition of a PCB using RGB colors are disclosed. The analyzing method includes the steps of feeding a target PCB, to be measured, to an image pick-up position where a pick-up unit is disposed, by a feeding unit, picking up an image of a metal surface of the fed target PCB, extracting pixel data from the picked-up image for the target PCB, performing a mapping operation for RGB signals of the extracted pixel data in accordance with a mapping program, thereby determining relative RGB values, producing cumulative distribution data of the relative RGB values for the target PCB in accordance with an RGB-mapping process, and quantitatively determining the oxidation degree of the target PCB metal surface exhibited with the lapse of time, based on the cumulative distribution data.

Abstract: A system for and a method of analyzing the surface condition of a PCB using RGB colors are disclosed. The analyzing method includes the steps of feeding a target PCB, to be measured, to an image pick-up position where a pick-up unit is disposed, by a feeding unit, picking up an image of a metal surface of the fed target PCB, extracting pixel data from the picked-up image for the target PCB, performing a mapping operation for RGB signals of the extracted pixel data in accordance with a mapping program, thereby determining relative RGB values, producing cumulative distribution data of the relative RGB values for the target PCB in accordance with an RGB-mapping process, and quantitatively determining the oxidation degree of the target PCB metal surface exhibited with the lapse of time, based on the cumulative distribution data.

Abstract: Disclosed is a method for producing an SiC preform of a high volume fraction used for the manufacture of a metal matrix composite. The method involves the steps of mixing SiC particles of different particle sizes each selected from a range of 0.2 to 48 &mgr;m with an organic binder, an inorganic binder, an aggregating agent, and distilled water, thereby producing a mixture, and stirring the mixture in accordance with a ball milling process, thereby producing a slurry containing the SiC particles, pouring the slurry containing the SiC particles into a mold having upper and lower molds respectively provided with absorbent bodies, and squeezing the slurry in the mold, thereby reducing a residual moisture content of the slurry, completely drying the slurry reduced in residual moisture content, thereby producing an SiC preform, and calcinating the SiC preform. The preform is impregnated with a metal matrix while maintaining a high reinforcement volume fraction of 70 vol % or more.

Abstract: The present invention relates to a method of preparing a preform with a high volume fraction of SiC particles. A slurry containing SiC particles and binders is ball-milled and pressed in an apparatus to give a primary preform. This primary preform is dried at room temperature and then, at a high temperature. The dried primary preform is subjected to calcination to prepare the preform. In the apparatus, which comprises a bottom die; a top mold with a cavity, placed on the bottom die, an upper punch for pressing a material for the preform in the cavity; and two water-absorbers, one being inserted between the bottom die and the top mold, the other being placed on the top mold, the slurry is introduced in the cavity and pressed by the punch while the water is absorbed in the absorbers or drained through a gap between the bottom die and the top mold, thereby improving the volume fraction of SiC particles.