Patents by Inventor Hyo Young Kim

Hyo Young Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240264806
    Abstract: The present specification provides a method for a terminal performing visual coding, the method including: generating a page for the visual coding and placing an asset on the page; setting a target asset that is a target of the visual coding on the basis of the placed asset; setting a user motion associated with an interaction with a user; setting a result associated with the target asset on the basis of the user motion; and displaying the result of the target asset on the basis of the user motion inputted, in which the result includes: a “function” for controlling size, position and state value of the target asset; a “computation” for computing variables associated with the target asset; and a “function page” representing a movement of the page.
    Type: Application
    Filed: October 7, 2022
    Publication date: August 8, 2024
    Applicant: FAMPPY INC.
    Inventors: Hae Jin Park, Sang Yong Lee, Hyun Jin Park, Gun Young Lee, Hyo Jeong Chang, Kil Yong Um, Yong Sung Kim
  • Publication number: 20240268161
    Abstract: A display device includes a first transistor, a pixel electrode electrically connected to the first transistor, and a second transistor electrically connected to the first transistor. A nitrogen content per unit area of an active layer of the second transistor is greater than a nitrogen content per unit area of an active layer of the first transistor.
    Type: Application
    Filed: October 20, 2023
    Publication date: August 8, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Seung Bo SHIM, Hyo Jung KIM, Ji Hyeon SON, Jeong Yong LEE, Yoo Young PARK, Ji Myoung SEO
  • Patent number: 12047588
    Abstract: Disclosed herein is a method for adaptive bidirectional optical flow estimation for inter prediction compensation during video encoding. The method aims to reduce complexity and/or cost of bidirectional optical flow (BIO) at a pixel level or a subblock level.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: July 23, 2024
    Assignee: SK TELECOM CO., LTD.
    Inventors: Jeong-yeon Lim, Hyo Song Kim, Se-hoon Son, Jae-seob Shin, Sun-young Lee
  • Patent number: 12046464
    Abstract: A substrate cleaning composition, a method of cleaning a substrate using the same, and a method of fabricating a semiconductor device using the same, the substrate cleaning composition including a styrene copolymer including a first repeating unit represented by Formula 1-1a and a second repeating unit represented by Formula 1-1b; an additive represented by Formula 2-1; and an alcoholic solvent having a solubility of 500 g/L or less in deionized water,
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: July 23, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., DONGJIN SEMICHEM CO., LTD.
    Inventors: Ga Young Song, Mi Hyun Park, Jong Kyoung Park, Jung Youl Lee, Hyun Jin Kim, Hyo San Lee, Han Sol Lim, Hoon Han
  • Patent number: 12017315
    Abstract: A machining device can lengthen the lifespan of a tool and improve the machining quality of a workpiece by managing the amount of wear of the tool by machining the workpiece using the other portion of the tool when a portion of the tool is worn and the machining performance of the tool is decreased. The machining device includes: a tool-moving unit coupled to a machining unit to change the position of the tool with respect to the workpiece; a supporting unit supporting the workpiece; a sensor unit disposed at the machining unit and measuring a current amount supplied to a machining motor operating the tool, or an operation force of the tool; and a control unit receiving a measurement signal from the sensor unit and transmitting a control signal to the tool-moving unit and the supporting unit.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: June 25, 2024
    Assignee: Korea Institute of Industrial Technology
    Inventors: Tae Gon Kim, Hyo Young Kim, Seok Woo Lee
  • Publication number: 20240143357
    Abstract: A robotic process automation (RPA) bot execution optimization method is provided. The method includes installing an RPA agent and a default RPA engine on the computing system in a process of installing an RPA solution; acquiring, by the installed RPA agent, an execution request for an RPA bot; determining, by the installed RPA agent, a representative version of an RPA scenario for the RPA bot; preparing, by the installed RPA agent, an optimal RPA engine version for executing the RPA scenario representative version; and controlling, by the installed RPA agent, the prepared optimal RPA engine version to execute the RPA scenario.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG SDS CO., LTD.
    Inventors: Hwang Young JUNG, Hyo Young KIM, Jae Cheol LEE
  • Publication number: 20240142943
    Abstract: Provided is a method for recording a task including: recording a task using robotic process automation (RPA) solution; sequentially obtaining each event included in an event sequence generated as a result of the recording, wherein the event sequence includes information about a type of user manipulation, information about a target object position, and information about a target object type; correcting the target object type of the obtained event using the target object position of the obtained event; reproducing the obtained event using the target object position of the obtained event and a corrected target object type of the obtained event; and repeating the obtaining, the correcting, and the reproducing until an event included in the event sequence is exhausted.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG SDS CO., LTD.
    Inventors: Hyo Young KIM, Jae Cheol LEE
  • Patent number: 11931896
    Abstract: A robot system for adjusting a machining load depending on tool wear includes a robot that is coupled to a machining unit, moves the machining unit to change a position of a tool with respect to a machining target, and has a plurality of joints. The robot system further includes a support that supports the machining target and moves the machining target to change a position of the machining target with respect to the tool, a sensor unit that is provided on the machining unit and measures an amount of current supplied to a machining motor which operates the tool or an operation force of the tool, and a controller that receives a measurement signal from the sensor unit and transmits a control signal to the robot and the support.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: March 19, 2024
    Assignee: Korea Institute of Industrial Technology
    Inventors: Tae Gon Kim, Seok Woo Lee, Hyo Young Kim
  • Publication number: 20230385086
    Abstract: A method for recording robotics process automation (RPA) and executing RPA is provided. The method for recording RPA task may comprise receiving object information on an object selected by a user input for selecting the object inside a window region of an external desktop from an agent of the external desktop in response to the user input in a recording situation of the RPA task and adding action information to specification data of the RPA task by using the received object information.
    Type: Application
    Filed: May 26, 2023
    Publication date: November 30, 2023
    Applicant: SAMSUNG SDS CO., LTD.
    Inventors: Seung Woo LEE, Hyo Young Kim, Jae Cheol Lee, Hong Ryeol Lee
  • Publication number: 20230128862
    Abstract: Provided is a semiconductor package including a redistribution structure including at least one redistribution insulating layer and at least one redistribution pattern, at least one semiconductor chip located on the redistribution structure, and a molding layer located on the redistribution structure and covering the at least one semiconductor chip. The redistribution pattern includes a redistribution via passing through the redistribution insulating layer and extending in a first direction perpendicular to a top surface of the redistribution structure, and a redistribution line extending in a second direction parallel to the top surface of the redistribution structure. Inner side walls of the redistribution via have a certain inclination, and a difference between a thickness of a central portion of the redistribution line and a thickness of an edge of the redistribution line ranges from 1% to 10% of the thickness of the central portion of the redistribution line.
    Type: Application
    Filed: October 6, 2022
    Publication date: April 27, 2023
    Inventors: Yong Tae KWON, Hyo Young KIM, Eun Yeong SON, Seung Ho LEE, Kyeung Hwan KIM, Jong Hyun PARK
  • Publication number: 20230126185
    Abstract: The apparatus includes a section extraction module configured to receive an automation scenario including a plurality of sections, and to extract one or more sections of a plurality of job types, from among the plurality of sections, the one or more sections being executable in parallel, a section optimization module configured to generate a parallel execution section list by sorting the one or more sections based on priorities predetermined for the plurality of job types and a job scheduler configured to generate an idle bot list including an idle bot having an idle state between an execution start time and an execution end time of the automation scenario, and to match the idle bot included in the idle bot list to each of the one or more sections included in the parallel execution section list with reference to the at least one expected execution time period and the priorities.
    Type: Application
    Filed: October 25, 2022
    Publication date: April 27, 2023
    Applicant: SAMSUNG SDS CO., LTD.
    Inventors: Hyo Young Kim, Jae Cheol Lee, Koo Hyun Park
  • Publication number: 20230083354
    Abstract: A system for forming a non-woven, yarn structure for an engineered textile includes a jig having a plurality of upstanding pins and an automatic winding system for winding a plurality of continuous strands of yarn across the jig and around the upstanding pins. The automatic winding system includes a movement mechanism and a winding head coupled with the movement mechanism. The movement mechanism includes one or more motors that are configured to translate the winding head across a central workspace area of the jig. The winding head includes a rotatable base; a plurality of yarn guides arranged in a linear array and extending from the rotatable base, each yarn guide adapted to receive a different one of the continuous strands, and a rotation motor coupled to the rotatable base and configured to selectively rotate the base to alter an orientation of the linear array.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 16, 2023
    Applicant: NIKE, Inc.
    Inventors: EunYoung Byun, Ho Eun Kim, HyunWoo Jeon, SangWook Jeon, Hyo Young Kim, TaeYoon Kim, DongHoon Lee
  • Publication number: 20230081164
    Abstract: A method of creating an engineered textile includes placing a yarn-wound jig on an upper surface of a substrate, selectively printing or extruding a bonding material across the plurality of arranged yarn strands, solidifying the bonding material to bond adjacent ones of the plurality of arranged yarn strands together and form a bound plurality of arranged yarn strands, and removing the bound plurality of arranged yarn strands from the substrate and the frame.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 16, 2023
    Applicant: NIKE, Inc.
    Inventors: EunYoung Byun, Kevin R. Derr, Martin E. Evans, Ho Eun Kim, Eun Kyung Lee, Gwen Marks, Matthew D. Nordstrom, Todd A. Waatti, Chun-Hao Hsu, HyunWoo Jeon, Hyo Young Kim, TaeYoon Kim, I-Han Lan, Yi-Chia Liang
  • Patent number: 11542606
    Abstract: The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: January 3, 2023
    Assignee: Poongsan Corporation
    Inventors: Cheol Min Park, Hyo Moon Nam, Buem Jae Lee, Hyo Young Kim
  • Publication number: 20220323432
    Abstract: The present disclosure relates to nanoparticles for delivering a drug targeting brain cancer, whose surface is modified with a peptide for targeting brain cancer, a preparation method thereof, and a use thereof, and more particularly, to nanoparticles for delivering a drug targeting brain cancer, including porous silicon nanoparticles encapsulating an anticancer drug and a peptide with an ability to target brain cancer cells bound to the surface of the nanoparticles, a preparation method thereof, and a use thereof. The nanoparticles according to the present disclosure can be used as an effective drug delivery system for treating glioblastoma by allowing a conventional anticancer agent exhibiting low tissue specificity and solubility to be specifically delivered to glioblastoma in which a caveolin receptor is overexpressed through the blood-brain barrier to induce a more efficient glioblastoma therapeutic effect.
    Type: Application
    Filed: December 30, 2020
    Publication date: October 13, 2022
    Inventors: Dokyoung KIM, Hyo Young KIM, Rae Hyung KANG
  • Patent number: 11446254
    Abstract: The present invention relates to a molecule delivery technology and a carrier technology, which may selectively deliver a material to a desired specific cell and living tissue. The present invention may be utilized in the field of a drug carrier which effectively delivers an imaging probe and a therapeutic agent to an affected part.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: September 20, 2022
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Dae Ro Ahn, Se Hoon Kim, Kyoung Ran Kim, Hyo Young Kim, Yong Deok Lee
  • Publication number: 20220129691
    Abstract: A non-standard user interface object identification system includes an object candidate extractior that extracts one or more objects from an image, a first similarity analyzer that determines object type candidates of the one or more objects in accordance with similarities between the one or more objects and a standard user interface (UI) element, a second similarity analyzer that selects object type-specific weight values in accordance with layout characteristics of the one or more objects and determines object types of the one or more objects using the object type candidates and the object type-specific weight values, and an object identifier that receives type and characteristic information of a search target object and identifies the search target object in accordance with characteristic information and the object types of the one or more objects.
    Type: Application
    Filed: October 27, 2021
    Publication date: April 28, 2022
    Inventors: Hyo Young KIM, Koo Hyun PARK, Keun Taek PARK
  • Publication number: 20220110416
    Abstract: An upper for an article of footwear includes a fixed closure disposed on one of a medial side and a lateral side of the upper, a plurality of parallel first strands each extending from a first end attached to the other one of the medial side and the lateral side of the upper to a second end attached the other one of the medial side and the lateral side and including a first intermediate portion formed between the first end and the second end, and a plurality of parallel second strands each extending from a third end attached to the one of the medial side and the lateral side of the upper to a fourth end selectively attachable to the fixed closure. The second strands are looped around the first intermediate portion of respective ones of the first strands.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 14, 2022
    Applicant: NIKE, Inc.
    Inventors: Kevin R. Derr, Chin-Chen Huang, Hyo Young Kim, Cassidy R. Levy, Matthew D. Nordstrom, Gillermo Raffaele
  • Patent number: 11264330
    Abstract: Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: March 1, 2022
    Inventors: Yongtae Kwon, Eung Ju Lee, Yong Woon Yeo, Yun Mook Park, Hyo Young Kim, Jun Kyu Lee, Seok Hwi Cheon
  • Publication number: 20220009047
    Abstract: Provided is a machining method for improving machining quality for a machining target by minimizing vibrations occurring during machining of each machining region, deformation of a shape of the machining region, and a position error of the machining region by selecting a machining path in consideration of the number of fixing jigs and a distance between jigs at each machining region.
    Type: Application
    Filed: November 18, 2019
    Publication date: January 13, 2022
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Tae Gon KIM, Hyo Young KIM, Seok Woo LEE