Patents by Inventor Hyo Young Shin
Hyo Young Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240114777Abstract: The present disclosure relates to a plurality of host materials, an organic electroluminescent compound, and an organic electroluminescent device comprising the same. By comprising a specific combination of compounds according to the present disclosure as a plurality of host materials or by comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having lower driving voltage, higher luminous efficiency, and/or longer lifetime properties compared to the conventional organic electroluminescent devices.Type: ApplicationFiled: July 20, 2023Publication date: April 4, 2024Inventors: So-Young JUNG, Hyo-Nim SHIN, Doo-Hyeon MOON, Sang-Hee CHO, Hyun-Ju KANG
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Publication number: 20240114778Abstract: The present disclosure relates to an organic electroluminescent compound, a plurality of host materials, and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure or by comprising a specific combination of compounds according to the present disclosure as a plurality of host materials, it is possible to produce an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: ApplicationFiled: August 14, 2023Publication date: April 4, 2024Inventors: So-Young JUNG, Hyo-Nim SHIN, Seung-Hyun YOON, Hyun-Ju KANG, Ye-Jin JEON, Tae-Jun HAN, Mi-Ja LEE, Dong-Gil KIM, Sang-Hee CHO
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Publication number: 20240090321Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, an organic electroluminescent device having improved driving voltage, power efficiency and/or lifetime characteristics compared to conventional organic electroluminescent devices can be provided.Type: ApplicationFiled: July 17, 2023Publication date: March 14, 2024Inventors: So-Young JUNG, Hyun-Ju KANG, Sang-Hee CHO, Tae-Jun HAN, Hyo-Nim SHIN, Eun-Joung CHOI
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Publication number: 20240075853Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.Type: ApplicationFiled: April 13, 2023Publication date: March 7, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
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Patent number: 11924473Abstract: Disclosed herein is a method for decoding a video including determining a coding unit to be decoded by block partitioning, decoding prediction syntaxes for the coding unit, the prediction syntaxes including a skip flag indicating whether the coding unit is encoded in a skip mode, after the decoding of the prediction syntaxes, decoding transform syntaxes including a transformation/quantization skip flag and a coding unit cbf, wherein the transformation/quantization skip flag indicates whether inverse transformation, inverse quantization, and at least part of in-loop filterings are skipped, and the coding unit cbf indicates whether all coefficients in a luma block and two chroma blocks constituting the coding unit are zero, and reconstructing the coding unit based on the prediction syntaxes and the transform syntaxes.Type: GrantFiled: June 2, 2022Date of Patent: March 5, 2024Assignee: SK TELECOM CO., LTD.Inventors: Sun Young Lee, Jeong-yeon Lim, Tae Young Na, Gyeong-taek Lee, Jae-seob Shin, Se Hoon Son, Hyo Song Kim
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Patent number: 9024403Abstract: An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board.Type: GrantFiled: April 25, 2013Date of Patent: May 5, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Tae Sang Park, Hyo Young Shin
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Patent number: 8971047Abstract: A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.Type: GrantFiled: September 11, 2012Date of Patent: March 3, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Yong Won Lee, Tae Sang Park, Hyo Young Shin, Ji Young Jang, Young Jun Moon, Soon Min Hong
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Publication number: 20130285185Abstract: An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board.Type: ApplicationFiled: April 25, 2013Publication date: October 31, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Tae Sang PARK, Hyo Young Shin
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Patent number: 8350162Abstract: Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.Type: GrantFiled: March 12, 2010Date of Patent: January 8, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Hyun Tae Kim, Tae Sang Park, Young Jun Moon, Soon Min Hong, Hyo Young Shin
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Publication number: 20120212917Abstract: The three-dimensional stack structure includes a printed circuit board, a first wafer chip mounted on the printed circuit board, a second wafer chip stacked above the first wafer chip, and first interposers interposed between the second wafer chip and the printed circuit board. The first interposers are configured to electrically connect the second wafer chip to the printed circuit board.Type: ApplicationFiled: February 22, 2012Publication date: August 23, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyo Young Shin, Tae Sang Park, Young Jun Moon, Soon Min Hong
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Patent number: 8197284Abstract: Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.Type: GrantFiled: March 15, 2010Date of Patent: June 12, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Hyun Tae Kim, Tae Sang Park, Young Jun Moon, Soon Min Hong, Hyo Young Shin
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Publication number: 20100248505Abstract: Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.Type: ApplicationFiled: March 15, 2010Publication date: September 30, 2010Inventors: Hyun Tae Kim, Tae Sang Park, Young Jun Moon, Soon Min Hong, Hyo Young Shin
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Publication number: 20100243309Abstract: Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.Type: ApplicationFiled: March 12, 2010Publication date: September 30, 2010Inventors: Hyun Tae Kim, Tae Sang Park, Young Jun Moon, Soon Min Hong, Hyo Young Shin
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Publication number: 20090139758Abstract: A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.Type: ApplicationFiled: June 3, 2008Publication date: June 4, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyo Young Shin, Seung Boo Jung, Young Jun Moon, Soon Min Hong, Chang Yong Lee, Ja Myeong Koo, Hyun Tae Kim, Jong Bum Lee, Hyun Joo Han