Abstract: This invention relates to a positive photosensitive resin composition that includes a siloxane copolymer of two kinds of reactive silane compounds with specific structures wherein residual impurities such as unreacted monomers and catalysts are minimized, and a UV absorber including one or more kinds of phenol hydroxyl groups capable of crosslinking and an alkoxy group. Accordingly, the resin composition exhibits excellent performances such as sensitivity, resolution, and degree of planarization, and also has excellent weatherability and UV absorbance, thereby providing excellent panel reliability.

Abstract: The present disclosure relates to a photo-curable composition, a cured product thereof, and an optical member and a display device comprising same. The photo-curable composition has excellent low refractive index, light transmittance, and low haze characteristics by comprising a first olefinic monomer containing fluorine, a second olefinic monomer having an absolute viscosity of 7 cP or less at 25° C., a photo-polymerization initiator, and an amine compound.

Abstract: A positive-type photosensitive resin composition, an insulating film made from the same, and a display device including such insulating film are provided. The positive photosensitive resin composition is excellent in sensitivity and has excellent chemical resistance, heat resistance, and hygroscopicity by including a polymer containing a hydroxyl group.

Abstract: A photopolymerizable composition is provided, which enables formation of an optical member exhibiting improved optical properties including excellent high flexibility, high refractive index, light transmittance, and low haze, and includes viscosity properties suitable for inkjet processes; an optical element prepared therefrom; and a display device. The photopolymerizable composition includes at least one high refractive index monomer having a liquid refractive index of 1.51 or more before curing, at least one flexible monomer, and a photopolymerization initiator.

Abstract: The present disclosure relates to a thermosetting composition, an optical member formed therefrom, and a display device, the composition comprising a thermosetting resin, gas-containing particles and a monomer or an oligomer having two or more thermosetting functional groups, thereby having optical effects such as a low refractive index of 1.40 or less on light with a wavelength of 450 nm, high light transmittance, and low haze.

Abstract: A positive photosensitive resin composition and, more specifically, a positive photosensitive resin composition includes an alkali-soluble polymer resin comprising a polyimide precursor comprising a specific chemical structure; a quinone diazide compound; and a solvent. The positive photosensitive resin composition is a suitable matter for next-generation flexible displays and semiconductor packages.

Abstract: The present disclosure relates to a photopolymerizable composition which enables the formation of an optical member that exhibits improved optical properties, including excellent light transmittance, low haze, and high refractive index, an optical member and a display device formed therefrom. The photopolymerizable composition includes at least one olefinic monomer having a photocurable functional group, metal oxide particles, an amine compound having an amine group and a photocurable functional group, and a photopolymerization initiator.

Abstract: Proposed is a photosensitive resin composition including a siloxane copolymer having both a thermosetting functional group and a photocurable functional group. The composition, according to this disclosure, is capable of both thermal curing and photo-curing and thus can form a stable cured film in a flexible display process where a low-temperature process of 150° C. or less is essential.

Abstract: A positive photosensitive resin composition includes a polymer resin, a quinonediazide compound, and a solvent. The polymer resin includes (i) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 1, ii) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 2, and iii) 0 to 20 wt. % of a polyimide precursor having a structural unit represented by Formula 3. The quinonediazide compound is included in an amount of 5 to 50 parts by weight per 100 parts by weight of the polymer resin. The solvent is included in an amount of 100 to 2,000 parts by weight per 100 parts by weight of the polymer resin.

Abstract: The present disclosure relates to a photopolymerizable composition capable of improving UV transmittance while maintaining excellent performance such as dielectric constant and sensitivity of a display device, and a cured film and a display device using the same.

Abstract: A photosensitive resin composition includes: a) an acryl-based copolymer obtained by copolymerizing i) a hydroxyl group-containing unsaturated compound; ii) an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof; iii) an epoxy group-containing unsaturated compound; and iv) an olefin-based unsaturated compound, b) a 1,2-quinonediazide 5-sulfonic ester compound having a phenol compound including a compound represented by the above Chemical Formula A as ballast, c) a silane coupling agent, and d) a solvent.

Abstract: A photosensitive resin composition includes: a) an acryl-based copolymer obtained by copolymerizing i) a hydroxyl group-containing unsaturated compound; ii) an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof; iii) an epoxy group-containing unsaturated compound; and iv) an olefin-based unsaturated compound, b) a 1,2-quinonediazide 5-sulfonic ester compound having a phenol compound including a compound represented by the above Chemical Formula A as ballast, c) a silane coupling agent, and d) a solvent.

Abstract: A positive photosensitive siloxane resin composition includes a) a siloxane copolymer obtained by performing hydrolysis and condensation polymerization of i) at least one reactive silane represented by the following Chemical Formula 1 and ii) at least one 4-functional reactive silane represented by the following Chemical Formula 2 under a catalyst, the copolymer having a polystyrene-converted weight average molecular weight Mw of 1,000 to 20,000, b) a 1,2-quinonediazide compound, and c) a solvent, (R1)nSi(R2)4-n??[Chemical Formula 1] Si(R3)4??[Chemical Formula 2] wherein R1s may each independently be any one of an alkyl group having 1 to 10 carbon atoms and an aryl group having 6 to 15 carbon atoms, R2 may be an alkoxy group having 1 to 4 carbon atoms, phenoxy, or acetoxy, R3s may each independently be any one of an alkoxy group having 1 to 4 carbon atoms, phenoxy, or an acetoxy group, and n may be a natural number of 1 to 3.

Abstract: A photoresist composition includes about 0.1 to about 30 parts by weight of a photo-initiator, about 1 to 50 parts by weight of a first acrylate monomer including at least five functional groups, about 1 to 50 parts by weight of a second acrylate monomer including at most four functional groups with respect to about 100 parts by weight of an acryl-copolymer.

Abstract: A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pKa value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.

Abstract: A photosensitive resin composition is disclosed. The disclosed photosensitive resin composition includes an acryl-based copolymer formed by copolymerizing i) unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, or a mixture thereof, and ii) an olefin-based unsaturated compound or a mixture thereof, a dissolution inhibitor in which a phenolic hydroxyl group is protected by an acid-degradable acetal or ketal group, a photoacid generator, and a solvent.

Abstract: A positive photosensitive siloxane resin composition includes a) a siloxane copolymer obtained by performing hydrolysis and condensation polymerization of i) at least one reactive silane represented by the following Chemical Formula 1 and ii) at least one 4-functional reactive silane represented by the following Chemical Formula 2 under a catalyst, the copolymer having a polystyrene-converted weight average molecular weight Mw of 1,000 to 20,000, b) a 1,2-quinonediazide compound, and c) a solvent, (R1)nSi(R2)4-n ??[Chemical Formula 1] Si(R3)4 ??[Chemical Formula 2] wherein R1s may each independently be any one of an alkyl group having 1 to 10 carbon atoms and an aryl group having 6 to 15 carbon atoms, R2 may be an alkoxy group having 1 to 4 carbon atoms, phenoxy, or acetoxy, Ras may each independently be any one of an alkoxy group having 1 to 4 carbon atoms, phenoxy, or an acetoxy group, and n may be a natural number of 1 to 3.

Abstract: A photosensitive resin composition includes: an acrylic copolymer comprising a polymerization product of a first monomer comprising at least one selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a second monomer comprising an olefin-based unsaturated compound; a photosensitive component comprising at least one 1,2-quinonediazide-5-sulfonic acid ester compound selected from compounds represented by Chemical Formulae 1 to 4; a coupling agent; and a solvent, wherein a total amount of asymmetric compounds in the photosensitive component is greater than or equal to 45 area percent as determined by high performance liquid chromatography: wherein R1 is a hydroxyl group or a methyl group, and NQD is a 1,2-quinonediazide 5-sulfonyl group.

Abstract: A photoresist composition a photoresist composition includes about 0.1 to about 30 parts by weight of a photo-initiator, about 1 to 50 parts by weight of a first acrylate monomer including at least five functional groups, about 1 to 50 parts by weight of a second acrylate monomer including at most four functional groups with respect to about 100 parts by weight of an acryl-copolymer.

Abstract: A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pKa value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.