Abstract: Disclosed is an information storing device which includes a first interface for connection with a host; a second interface for connection with the host; a first memory unit including a first controller controlling a first nonvolatile memory, the first controller communicating with the host via the first interface; and a second memory unit including a second controller controlling a second nonvolatile memory, the second controller communicating with the host via the second interface.

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. According to example embodiments, a solid state device (SSD) may include a circuit board, a connector, and a case. The circuit board may include a unibody board common to at least a first and a second form factor, first circuit board connection terminals of the first form factor on a front side of the board, and second circuit board connection terminals of the second form factor on a back side of the board. The connector may include connector connection terminals, where only one of the first circuit board connection terminals and the second circuit board connection terminals are connected to the connector connection terminals.

Abstract: A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.

Abstract: A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.

Abstract: A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics.

Abstract: A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.

Abstract: One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.

Abstract: A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Abstract: A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

Abstract: A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

Abstract: Provided is a memory module. The memory module may include a mounting substrate including a plurality of first substrate pads disposed on a top surface of the mounting substrate, a first semiconductor package disposed on a top surface of the mounting substrate, the first semiconductor package having a first frame and first external connection terminals which extend through the outside of the first frame and are disposed on the first substrate pads, a first connection member including first connection terminals disposed between the first external connection terminals and the first substrate pads and a pressure fixing member compressing the first connection member to electrically connect the first external connection terminals and the first substrate pads by the medium of the first connection terminals.