Patents by Inventor Hyosung KOO

Hyosung KOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230230952
    Abstract: Disclosed are wire clamps and wire bonding apparatuses including the same. The wire clamp comprises a clamping lever, a driving lever parallel to the clamping lever and having an upper support, a shaft that penetrates a center of the driving lever to connect to the clamping lever, a spring in the driving lever and on an outer circumferential surface of the shaft, and an upper pivot that protrudes from an inner wall of the upper support to separate the upper support from the clamping lever. The driving lever has a load point and an effort point on opposite sides of the shaft. The effort point is connected in a direction of a straight line to the shaft and the effort point.
    Type: Application
    Filed: October 4, 2022
    Publication date: July 20, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jaehyeok HEO, Hyosung KOO, Munsoo PARK, Yong Je LEE
  • Patent number: 10643966
    Abstract: An electrical interconnection includes a wire loop having a first end bonded to a first bonding site using a first bonding portion, and a second end bonded to a second bonding site using a second bonding portion. The second bonding portion includes a folded portion having a wire that extends from the second end of the wire loop and is folded on the second bonding site. The folded portion includes a first folded portion connected to the second end of the wire loop and extending toward the first bonding site, a second folded portion provided on the first folded portion, and a tail protruding from a portion of the second folded portion. An interface is formed between the first and second folded portions. A top surface of the second folded portion includes an inclined surface recessed toward the first folded portion.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Hyosung Koo
  • Publication number: 20180331064
    Abstract: An electrical interconnection includes a wire loop having a first end bonded to a first bonding site using a first bonding portion, and a second end bonded to a second bonding site using a second bonding portion. The second bonding portion includes a folded portion having a wire that extends from the second end of the wire loop and is folded on the second bonding site. The folded portion includes a first folded portion connected to the second end of the wire loop and extending toward the first bonding site, a second folded portion provided on the first folded portion, and a tail protruding from a portion of the second folded portion. An interface is formed between the first and second folded portions. A top surface of the second folded portion includes an inclined surface recessed toward the first folded portion.
    Type: Application
    Filed: July 19, 2018
    Publication date: November 15, 2018
    Inventor: Hyosung KOO
  • Publication number: 20170179065
    Abstract: An electrical interconnection includes a wire loop having a first end bonded to a first bonding site using a first bonding portion, and a second end bonded to a second bonding site using a second bonding portion. The second bonding portion includes a folded portion having a wire that extends from the second end of the wire loop and is folded on the second bonding site. The folded portion includes a first folded portion connected to the second end of the wire loop and extending toward the first bonding site, a second folded portion provided on the first folded portion, and a tail protruding from a portion of the second folded portion. An interface is formed between the first and second folded portions. A top surface of the second folded portion includes an inclined surface recessed toward the first folded portion.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 22, 2017
    Inventor: Hyosung KOO