Abstract: In one example, an electronic device can comprise a substrate, a substrate sidewall over a side of the substrate. An electronic device can be disposed over the side of substrate and adjacent the substrate sidewall. An internal interconnect can be disposed between the electronic device and the substrate sidewall. An encapsulant can cover the internal interconnect between the electronic device and the substrate sidewall. A lid attach material can be disposed over the substrate sidewall and the encapsulant. A lid can be coupled to the encapsulant and the substrate sidewall by the lid attach material. A cavity can be defined between a bottom side of the lid and a top side of the electronic device. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.

Abstract: An electrical connector assembly includes an electrically conductive structure having a flat flexible conductor with a plurality of end portions. Each of the plurality of end portions includes a plurality of electrically conductive traces. A plurality of wire contact wedges respectively support the plurality of end portions of the electrically conductive structure. A connector housing supports the plurality of wire contact wedges and the electrically conductive structure.

Abstract: In one example, an electronic device includes a substrate including a substrate upper side and a conductive structure comprising substrate upper terminals adjacent to the substrate upper side. Vertical interconnects are coupled to the substrate upper terminals. An encapsulant covers portions of the substrate and the vertical interconnects. The vertical interconnects are exposed from an upper side of the encapsulant. A redistribution structure is over the encapsulant and includes a redistribution structure upper side, a redistribution structure lower side, a redistribution dielectric structure, and a redistribution conductive structure. The redistribution structure includes redistribution upper terminals adjacent to the redistribution structure upper side and redistribution bottom terminals adjacent to the redistribution lower side. The redistribution bottom terminals are coupled to the vertical interconnects and the redistribution upper terminals.

Abstract: An electrical connector assembly quickly and easily provides mechanical and electrical connections between two flat flexible conductors, each having multiple electrically conductive traces provided thereon, in a sealed environment that resists the entry of contaminants therein. The electrical connector assembly includes an electrically conductive structure, a wire contact wedge supporting the electrically conductive structure, a connector housing supporting the wire contact wedge and the electrically conductive structure, and a front cover supported on the connector housing.

Abstract: In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: In one example, an electronic device, comprises a substrate comprising a dielectric structure and a conductive structure, an electronic component over a top side of the substrate, wherein the electronic component is coupled with the conductive structure; an encapsulant over the top side of the substrate and contacting a lateral side of the electronic component, wherein the encapsulant comprises a first trench on a top side of the encapsulant adjacent to the electronic component, a lid over the top side of the encapsulant and covering the electronic component; and an interface material between the top side of the encapsulant and the lid, and in the first trench. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: An electrical connector assembly includes a housing defining an interior space and a slot and a spring pin terminal disposed within the slot of the housing. The spring pin terminal includes a first contact portion, a second contact portion, and an intermediate portion that extends between the first contact portion and the second contact portion. The first contact portion includes a contact point that engages a first electrically conductive structure and a retention force support that engages a portion of the intermediate portion of the spring pin terminal. The second contact portion includes a contact point that engages a second electrically conductive structure and a retention force and alignment support that engages the intermediate portion of the spring pin terminal.

Abstract: In one example, a semiconductor device, comprises a first redistribution layer (RDL) substrate comprising a first dielectric structure and a first conductive structure through the first dielectric structure and comprising one or more first conductive redistribution layers, an electronic component over the first RDL substrate, wherein the electronic component is coupled with the first conductive structure, a body over a top side of the first RDL substrate, wherein the electronic component is in the body, a second RDL substrate comprising a second dielectric structure over the body, and a second conductive structure through the second dielectric structure and comprising one or more second conductive redistribution layers, and an internal interconnect coupled between the first conductive structure and the second conductive structure. Other examples and related methods are also disclosed herein.

Abstract: An electrical connector assembly includes an electrically conductive structure having a flat flexible conductor with a plurality of end portions. Each of the plurality of end portions includes a plurality of electrically conductive traces. A plurality of wire contact wedges respectively support the plurality of end portions of the electrically conductive structure. A connector housing supports the plurality of wire contact wedges and the electrically conductive structure.

Abstract: A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.

Abstract: In one example, a semiconductor device, comprises a first redistribution layer (RDL) substrate comprising a first dielectric structure and a first conductive structure through the first dielectric structure and comprising one or more first conductive redistribution layers, an electronic component over the first RDL substrate, wherein the electronic component is coupled with the first conductive structure, a body over a top side of the first RDL substrate, wherein the electronic component is in the body, a second RDL substrate comprising a second dielectric structure over the body, and a second conductive structure through the second dielectric structure and comprising one or more second conductive redistribution layers, and an internal interconnect coupled between the first conductive structure and the second conductive structure. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.

Abstract: In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.

Abstract: An electrical connector assembly includes a housing defining an interior space and a slot and a spring pin terminal disposed within the slot of the housing. The spring pin terminal includes a first contact portion, a second contact portion, and an intermediate portion that extends between the first contact portion and the second contact portion. The first contact portion includes a contact point that engages a first electrically conductive structure and a retention force support that engages a portion of the intermediate portion of the spring pin terminal. The second contact portion includes a contact point that engages a second electrically conductive structure and a retention force and alignment support that engages the intermediate portion of the spring pin terminal.

Abstract: In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A sealed electrical connector assembly includes a connector housing having a first end, a second end, and an opening that extends from the first end to the second end. The opening defines an inner surface of the connector housing. A seal is disposed within the opening of the connector housing and includes a first end, a second end, an outer surface, and a slot that extends from the first end of the seal to the second end of the seal. The outer surface of the seal is in sealing engagement with the inner surface of the connector housing, and the slot defines an inner surface of the seal. A flat flexible conductor disposed within the slot of the seal and includes a plurality of electrically conductive traces and an outer surface. The outer surface of the flat flexible conductor is in sealing engagement with the inner surface of the seal.

Abstract: The present disclosure relates to a sensor boss, a sensor assembly and an exhaust system, wherein the sensor boss comprises a base and a fluid channel, the base comprises a base body and a mounting hole penetrating the base body, the mounting hole is used to install a sensor through it, the base body is used to fix the sensor boss on a fluid pipeline, and the fluid channel extends from an inlet end to an outlet end in a first direction to accommodate a probe of the sensor.