Patents by Inventor Hyoun S. Choe

Hyoun S. Choe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of depositing diffusion barrier for copper interconnect in integrated circuit
    Patent number: 6534404
    Abstract: Diffusion barriers are used in integrated circuits. The present method of depositing diffusion barriers eliminates the formation of high resistivity phases, providing high electrical conductivity and diffusion suppression between the interconnect conductors, for example copper, and the semiconductor device. In a preferred embodiment, the diffusion barrier is formed by depositing a film of binary transition metal nitride then treating the film in a gas containing silicon in order to form a layer of silicon rich material on the surface of the binary transition metal nitride film.
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: March 18, 2003
    Assignee: Novellus Systems, Inc.
    Inventors: Michal Danek, Karl B. Levy, Hyoun S. Choe
  • Solid polymer electrolytes
    Patent number: 5474860
    Abstract: This invention relates to Li ion (Li.sup.+) conductive solid polymer electrolytes composed of poly(vinyl sulfone) and lithium salts, and their use in all-solid-state rechargeable lithium ion batteries. The lithium salts comprise low lattice energy lithium salts such as LiN(CF.sub.3 SO.sub.2).sub.2, LiAsF.sub.6, and LiClO.sub.4.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: December 12, 1995
    Assignee: EIC Laboratories, Inc.
    Inventors: Kuzhikalail M. Abraham, Mohamed Alamgir, Hyoun S. Choe