Abstract: A computer-implemented method includes placing standard cells based on design data defining an integrated circuit. A layout of the integrated circuit is generated by performing colorless routing. First, second, third and fourth patterns included in a quadruple patterning lithography (QPL) layer are arranged, based on space constraints, on the placed standard cells. The generated layout is stored to a computer-readable storage medium. The space constraints define minimum spaces between the first, second, third and fourth patterns. The method includes assigning first, second, third and fourth colors to the first, second, third and fourth patterns, respectively. Masks are generated based on the layout. A semiconductor device is manufactured by using the generated masks. A space between two patterns of the first, second, third and fourth patterns smaller than a corresponding space constraint of the space constraints indicates a color violation.

Abstract: A computer-implemented method compresses placing standard cells based on design data defining an integrated circuit (IC). A layout of the IC is generated by performing colorless routing, by which a first pattern, a second pattern, and a third pattern in a triple patterning lithography (TPL) layer are arranged on the placed standard cells. The arrangement is based on space constraints. The generated layout is stored to a non-transitory computer-readable storage medium. The space constraints define minimum spaces between the first pattern, the second pattern, and the third pattern. A color violation does not occur between the first pattern, second pattern, and the third pattern. A first mask, a second mask, and a third mask are generated based on the layout. A semiconductor device is manufactured by using the generated first mask, the second mask, and the third mask.

Abstract: A computer-implemented method includes placing standard cells based on design data defining an integrated circuit. A layout of the integrated circuit is generated by performing colorless routing. First, second, third and fourth patterns included in a quadruple patterning lithography (QPL) layer are arranged, based on space constraints, on the placed standard cells. The generated layout is stored to a computer-readable storage medium. The space constraints define minimum spaces between the first, second, third and fourth patterns. The method includes assigning first, second, third and fourth colors to the first, second, third and fourth patterns, respectively. Masks are generated based on the layout. A semiconductor device is manufactured by using the generated masks. A space between two patterns of the first, second, third and fourth patterns smaller than a corresponding space constraint of the space constraints indicates a color violation.

Abstract: A computer-implemented method. Standard cells are placed based on design data defining the integrated circuit (IC). A layout of the IC is generated by performing colorless routing, by which first through third patterns in a triple patterning lithography (TPL) layer are arranged on the placed standard cells. The arrangement is based on space constraints. The generated layout is stored to a computer-readable storage medium. The space constraints define minimum spaces between the first through third patterns. A color violation does not occur between the first through third patterns. First, second, and third masks are generated based on the layout. A semiconductor device is manufactured by using the generated first, second, and third masks.

Abstract: The integrated circuit includes first and second vias, a first buffer configured to receive a signal transmitted from the first via, a second buffer configured to receive a signal transmitted from the second via, a first detour circuit configured to receive a signal transmitted through the second buffer, a second detour circuit configured to receive a signal transmitted through the first buffer, a first selector configured to selectively output one of the signal transmitted from the first via and a signal transmitted through the first detour circuit, and a second selector configured to selectively output one of the signal transmitted from the second via and a signal transmitted through the second detour circuit. Each of the first and second buffers and the first and second detour circuits transmits a signal in only one direction.

Abstract: The integrated circuit includes first and second vias, a first buffer configured to receive a signal transmitted from the first via, a second buffer configured to receive a signal transmitted from the second via, a first detour circuit configured to receive a signal transmitted through the second buffer, a second detour circuit configured to receive a signal transmitted through the first buffer, a first selector configured to selectively output one of the signal transmitted from the first via and a signal transmitted through the first detour circuit, and a second selector configured to selectively output one of the signal transmitted from the second via and a signal transmitted through the second detour circuit. Each of the first and second buffers and the first and second detour circuits transmits a signal in only one direction.

Abstract: A semiconductor integrated circuit which includes a control circuit; and a power management integrated circuit (IC) configured to supply an operating voltage to the control circuit. The control circuit includes a clock generator; a processor unit; a temperature sensor; a body bias generator; and a controller. The controller controls the power management IC and the clock generator when temperature data indicates a temperature higher than a high temperature and controls the power management IC or the body bias generator when the temperature data indicates a temperature lower than a low temperature. The high temperature is lower than a hot temperature of the control circuit and the low temperature is higher than a cold temperature of the control circuit and lower than the high temperature.

Abstract: A semiconductor integrated circuit which includes a control circuit; and a power management integrated circuit (IC) configured to supply an operating voltage to the control circuit. The control circuit includes a clock generator; a processor unit; a temperature sensor; a body bias generator; and a controller. The controller controls the power management IC and the clock generator when temperature data indicates a temperature higher than a high temperature and controls the power management IC or the body bias generator when the temperature data indicates a temperature lower than a low temperature. The high temperature is lower than a hot temperature of the control circuit and the low temperature is higher than a cold temperature of the control circuit and lower than the high temperature.

Abstract: Provided is a method of optimizing statistical timing of an integration circuit, the method including applying subtle changes of mean arrival times with respect to each of nodes in a timing graph of an integrated circuit to ADD operations and MAX operations of a block-based statistical static timing analysis (SSTA) method and approximating the corresponding operations; generating Jacobian matrixes between each node by using matrix components including differential coefficients calculated during linear approximation of the operations; calculating changed arrival time values of the circuit by propagating the Jacobian matrixes from a virtual sink node to a virtual source node; and calculating timing yield criticalities, which are variances of timing yield of the circuit due to subtle changes of mean arrival times with respect to each node, based on values obtained by the propagation.

Abstract: The present invention relates to a level converter used in a multiple supply voltage system that is required to design a low-power and high-performance semiconductor, and more particularly, to a single supply pass gate level converter (SPLC) for a multiple supply voltage system, which has low power consumption, operates at high speed, and uses only a single supply voltage. The SPLC includes an input data providing circuit unit which receives an input signal of a low supply voltage; a data inversion circuit unit which receives input data from the input data providing circuit unit and outputs inversed input data; a feedback circuit unit which is fed back by an output of the data inversion circuit unit; and a data output buffer which inverses an output of the data inversion circuit unit and outputs an inversed signal.

Abstract: Provided is a method of optimizing statistical timing of an integration circuit, the method including applying subtle changes of mean arrival times with respect to each of nodes in a timing graph of an integrated circuit to ADD operations and MAX operations of a block-based statistical static timing analysis (SSTA) method and approximating the corresponding operations; generating Jacobian matrixes between each node by using matrix components including differential coefficients calculated during linear approximation of the operations; calculating changed arrival time values of the circuit by propagating the Jacobian matrixes from a virtual sink node to a virtual source node; and calculating timing yield criticalities, which are variances of timing yield of the circuit due to subtle changes of mean arrival times with respect to each node, based on values obtained by the propagation.

Abstract: The present invention relates to a level converter used in a multiple supply voltage system that is required to design a low-power and high-performance semiconductor, and more particularly, to a single supply pass gate level converter (SPLC) for a multiple supply voltage system, which has low power consumption, operates at high speed, and uses only a single supply voltage. The SPLC includes an input data providing circuit unit which receives an input signal of a low supply voltage; a data inversion circuit unit which receives input data from the input data providing circuit unit and outputs inversed input data; a feedback circuit unit which is fed back by an output of the data inversion circuit unit; and a data output buffer which inverses an output of the data inversion circuit unit and outputs an inversed signal.

Abstract: The present invention relates to a method to manufacture steel sheets coated with Zn—Fe alloy with an excellent corrosion resistance used in producing a body frame and a chassis of an automobile under optimal coating conditions by adjusting the temperature, pH, electric current density of an electrolyte consisting of zinc sulfate hydrate, iron sulfate hydrate, ammonium sulfate and potassium chloride as well as the thickness of a coating layer.