Abstract: Provided is a scanning arm which moves to collect pollutants on the surface of a semiconductor wafer, for use in a semiconductor wafer pollutant measurement apparatus, and a scanning device using the same. The scanning arm includes: an X-axis portion; a Z-axis portion which is perpendicularly installed with the X-axis portion so as to move forward and backward along the X-axis portion; and a Y-axis portion which is perpendicularly installed with the Z-axis portion so as to move up and down with respect to the Z-axis portion.

Abstract: Provided is a scan stage for a semiconductor wafer pollutant measurement apparatus, which includes: a stage main body which comprises: a circular fixed housing; an adsorption plate which is rotatably installed in the inside of the fixed housing, at the center of which an adsorption path is formed, at the bottom of which a vacuum port is connected, and which is rotated by an external rotating force; and a step motor which is placed at the bottom of the fixed housing and connected with the adsorption plate; a base plate that is supported by pillars to form a lower space between the fixed housing of the stage main body and the base plate; a cylinder at the bottom of which a cylinder load is connected so that the base plate moves up and down; and support jigs that hold up a wafer in the outer side of the stage main body, in which three support jigs are disposed in proximity with the outer circumference of the stage main body.

Abstract: Provided is a scanning arm which moves to collect pollutants on the surface of a semiconductor wafer, for use in a semiconductor wafer pollutant measurement apparatus, and a scanning device using the same the scanning arm includes: an X-axis portion; a Z-axis portion which is perpendicularly installed with the X-axis portion so as to move forward and backward along the X-axis portion; and a Y-axis portion which is perpendicularly installed with the Z-axis portion so as to move up and down with respect to the Z-axis portion. The scanning device includes: the scanning arm; and a scanning nozzle which is installed at the Y-axis portion, and inhales a scan solution from a reagent solution bottle to then discharge a reagent scan solution on the surface of a wafer which is located on a scan stage and simultaneously keep an inhalation condition and move along the surface of the wafer, to then inhale and keep the scan solution including pollutants sticked on the wafer surface.

Abstract: Provided is a vapor phase decomposition (VPD) device for a semiconductor wafer pollutant measurement apparatus and a door opening and closing device thereof. The VPD device includes: a rectangular vessel-shaped main body of the VPD device and a door which covers in a sealed form or opens the wafer inlet of the VPD device. Here, a predetermined space is formed in the inner portion of the rectangular vessel-shaped main body, support plates are formed on the bottom of the rectangular vessel-shaped main body and gas discharge and suction nozzles are located therein. In addition, a transparent see-through window is formed on the upper surface of the rectangular vessel-shaped main body, a detection electrode for controlling an inner atmosphere is formed at the center of the transparent see-through window, and one side surface of the rectangular vessel-shaped main body is opened to thus form a wafer inlet for introducing a wafer.

Abstract: Provided is a scan stage for a semiconductor wafer pollutant measurement apparatus, which includes: a stage main body which comprises: a circular fixed housing; an adsorption plate which is rotatably installed in the inside of the fixed housing, at the center of which an adsorption path is formed, at the bottom of which a vacuum port is connected, and which is rotated by an external rotating force; and a step motor which is placed at the bottom of the fixed housing and connected with the adsorption plate; a base plate that is supported by pillars to form a lower space between the fixed housing of the stage main body and the base plate; a cylinder at the bottom of which a cylinder load is connected so that the base plate moves up and down; and support jigs that hold up a wafer in the outer side of the stage main body, in which three support jigs are disposed in proximity with the outer circumference of the stage main body.