Patents by Inventor Hyoung-Chan Chang

Hyoung-Chan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tape circuit board and semiconductor chip package including the same
    Patent number: 6818542
    Abstract: A tape circuit board for manufacturing a fine pitch semiconductor chip package, a method for manufacturing the tape circuit board, and a semiconductor chip package using the tape circuit board are provided. The tape circuit board includes an insulating base film having a first surface and a second surface. An adhesive layer is formed on the first surface of the base film. Further, wiring patterns are formed on the adhesive layer. Conductive bumps extend through the base film and the adhesive layer and are connected to the wiring patterns. The conductive bumps extend above the second surface of the base film.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: November 16, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae-Woo Son, Hyoung-Chan Chang
  • Tape circuit board and semiconductor chip package including the same
    Publication number: 20040175915
    Abstract: A tape circuit board for manufacturing a fine pitch semiconductor chip package, a method for manufacturing the tape circuit board, and a semiconductor chip package using the tape circuit board are provided. The tape circuit board includes an insulating base film having a first surface and a second surface. An adhesive layer is formed on the first surface of the base film. Further, wiring patterns are formed on the adhesive layer. Conductive bumps extend through the base film and the adhesive layer and are connected to the wiring patterns. The conductive bumps extend above the second surface of the base film.
    Type: Application
    Filed: March 16, 2004
    Publication date: September 9, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dae-Woo Son, Hyoung-Chan Chang
  • Tape circuit board and semiconductor chip package including the same
    Patent number: 6737590
    Abstract: A tape circuit board for manufacturing a fine pitch semiconductor chip package, a method for manufacturing the tape circuit board, and a semiconductor chip package using the tape circuit board are provided. The tape circuit board includes an insulating base film having a first surface and a second surface. An adhesive layer is formed on the first surface of the base film. Further, wiring patterns are formed on the adhesive layer. Conductive bumps extend through the base film and the adhesive layer and are connected to the wiring patterns. The conductive bumps extend above the second surface of the base film.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: May 18, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae-Woo Son, Hyoung-Chan Chang
  • Tape circuit board and semiconductor chip package including the same
    Publication number: 20020104684
    Abstract: A tape circuit board for manufacturing a fine pitch semiconductor chip package, a method for manufacturing the tape circuit board, and a semiconductor chip package using the tape circuit board are provided. The tape circuit board includes an insulating base film having a first surface and a second surface. An adhesive layer is formed on the first surface of the base film. Further, wiring patterns are formed on the adhesive layer. Conductive bumps extend through the base film and the adhesive layer and are connected to the wiring patterns. The conductive bumps extend above the second surface of the base film.
    Type: Application
    Filed: January 28, 2002
    Publication date: August 8, 2002
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dae-Woo Son, Hyoung-Chan Chang