Abstract: Embodiments herein relate to thermal coupling using through mold vias (TMV). Embodiments may include a substrate having a first side and a second side opposite the first side, a processor having a first side and the second side, the first side of the processor coupled to the first side of the substrate, one or more solder balls where the first side of the one or more solder balls are thermally coupled to the second side of the processor and where the solder balls are embedded in one or more TMVs in a molding extending from a first side of the molding to a second side of the molding opposite the first side of the molding. Other embodiments may be described and/or claimed.

Abstract: Provided herein are a motor control apparatus, an image forming apparatus, an image forming apparatus including the same, and a motor control method, by which position error of a motor and a control value for compensating for the position error are calculated and reflected in feedback control, thereby quickly removing position error of the motor.

Abstract: An image forming apparatus to control a distance between paper sheets by sensing a surface pattern of fed paper and a method of controlling the same is provided. The image forming apparatus may include a paper transport unit configured to transport paper, a paper sensing unit disposed in a transport path of the paper and configured to sense a surface pattern of the transported paper, and a controller configured to control the paper transport unit to adjust a distance between paper sheets based on a change in the sensed surface pattern of the paper.

Abstract: Disclosed herein are a motor control apparatus, an image forming apparatus, an image forming apparatus including the same, and a motor control method, by which position error of a motor and a control value for compensating for the position error are calculated and reflected in feedback control, thereby quickly removing position error of the motor.