Patents by Inventor Hyoung J. Yoo

Hyoung J. Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transport device for wafers of variable diameter
    Patent number: 4971512
    Abstract: A transport device for handling wafers of different diameters utilized in the manufacture of semiconductors. A robotic arm is equipped with a fork-shaped wafer support board and an arm slide movable relative to the robotic arm. The fork-shaped end of the support board is provided with fixed pins on one side to support wafers and on another side with plate springs carrying pins which can be depressed by the weight of a wafer to accommodate larger size wafers. The device permits wafers of different diameters accurately and safely to be transferred from its center to a predetermined station without the need for changing the wafer support board or correction of the robotic arm.
    Type: Grant
    Filed: December 16, 1988
    Date of Patent: November 20, 1990
    Assignees: Korea Electronics and Telecommunications Research Institute, Korea Telecommunication Authority
    Inventors: Sang S. Lee, Bong K. Kang, Seung K. Park, Hyoung J. Yoo