Abstract: The present disclosure discloses a substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam transmitting plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a VCSEL beam having a single wavelength to a lower surface of the flat substrate through the beam transmitting plate; and an temperature measuring module configured to measure the laser beam reflected from the lower surface or an upper surface the flat substrate, thereby measuring the temperature of the flat substrate.

Abstract: The present disclosure discloses a substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam transmitting plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a VCSEL beam having a single wavelength to a lower surface of the flat substrate through the beam transmitting plate; and an emissivity measuring configured to measure the laser beam reflected from the lower surface or an upper surface the flat substrate, thereby measuring the emissivity of the flat substrate.

Abstract: The present disclosure provides substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam irradiating plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a laser beam to a lower surface of the flat substrate through the beam irradiating plate; and a gas circulation cooling module for spraying a cooling gas to an upper surface of the infrared transmitting plate, thereby cooling the infrared transmitting plate.

Abstract: The present disclosure discloses a flat substrate heating apparatus including a module support plate having a plurality of unit module regions placed on an upper surface thereof; a plurality of laser light source modules having a plurality of laser light source devices and seated on unit module regions of the module support plate, respectively; a power supply board placed below the module support plate and configured to supply power to the laser light source module; and an electrode terminal electrically connecting the laser light source module and the power supply board while detachably securing them to upper and lower surfaces of the module support plate.

Abstract: The present invention provides a correction steel sheet for quickly and accurately correcting the sensitivity of a sensor during hardness measurement in which a sudden signal change does not occur. In one embodiment, the correction steel sheet is a steel sheet having a long side and a short side and is used for correcting a sensor and includes a first part having a first hardness and a second part having a second hardness greater than the first hardness. The first part and the second part are arranged at different positions in a short side direction, and have phases changed from austenite grains of the same composition.

Abstract: A process control system according to one embodiment of the present invention comprises: a first system for generating thickness information about an internal defect layer included in a carbon steel product; and a second system which receives the thickness information about the internal defect layer from the first system through a network, and which controls an etching process for removing at least a part of the internal defect layer from the carbon steel product by using the thickness information about the internal defect layer, wherein the first system provides the second system with a calculation module necessary for the second system to control the etching process, and the second system provides the first system with the information necessary for the first system to update the calculation module.

Abstract: A pickling apparatus includes a plurality of pickling tanks in which a scale of a steel plate is removed while the steel plate is advanced and sequentially dipped; an intermediate spraying unit, disposed between a pickling tank at the front end and a pickling tank at the rear end, for spraying a pickling solution onto the steel plate; and a pickling solution supply means configured to provide a pickling solution of a concentration used in the pickling tank at the rear end to the intermediate spraying unit, wherein a wringer roll disposed between the plurality of pickling tanks is removed.

Abstract: A pickling apparatus includes a plurality of pickling tanks in which a scale of a steel plate is removed while the steel plate is advanced and sequentially dipped; an intermediate spraying unit, disposed between a pickling tank at the front end and a pickling tank at the rear end, for spraying a pickling solution onto the steel plate; and a pickling solution supply means configured to provide a pickling solution of a concentration used in the pickling tank at the rear end to the intermediate spraying unit, wherein a wringer roll disposed between the plurality of pickling tanks is removed.