Patents by Inventor Hyoung Shik Kang

Hyoung Shik Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230059293
    Abstract: Proposed is a method of processing micro-holes formed in an upper mold used for adsorbing, transferring, and laminating a thin structure. The micro-holes drilled by setting n mono-layers in a thickness direction of the upper mold, applying the femtosecond pulsed laser beam onto a second mono-layer in a given pattern, processing the micro-holes at a thickness of the next mono-layer in a 2D manner, and sequentially applying the femtosecond pulsed laser beam to the mono-layers while lowering a focus of the laser in units of 1 /n. The femtosecond pulsed laser beam is applied along inner surfaces of the micro-holes, thereby adjusting a dimension of a diameter of each of the micro-holes to be processed, and improving surface roughness of each of the inner surfaces of the micro-holes. Surroundings of an inlet-side edge are chamfered or rounded to prevent generation of the burrs and damage to the thin film sheet.
    Type: Application
    Filed: June 1, 2022
    Publication date: February 23, 2023
    Inventors: Sung Hwan KIM, Hyoung Shik KANG, Dong Sub PARK
  • Publication number: 20220241899
    Abstract: Proposed is a planing-polishing apparatus 1 using a femtosecond pulsed laser and performing polishing of a planar workpiece to reduce surface roughness of the workpiece after performing planing of the workpiece using a femtosecond pulsed laser beam.
    Type: Application
    Filed: August 17, 2021
    Publication date: August 4, 2022
    Inventors: Sung Hwan KIM, Hyoung Shik KANG, Dong Bin YOU
  • Patent number: 6812430
    Abstract: A glass cutting apparatus includes a positioning unit that positions a laser beam along a virtual line on a glass to be cut. A laser beam unit irradiates a laser beam onto the glass along the virtual line. The virtual line is divided into at least two portions and at least one of the two portions is divided into a plurality of sub-portions. The energy of the laser beam is maintained constant in each of the plurality of sub-portions. A related glass cutting method is also disclosed.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: November 2, 2004
    Assignee: LG Electronics Inc.
    Inventors: Hyoung Shik Kang, Soon Kug Hong, Seok Chang Oh, Min Gyu Song, Kwang Yeol Baek
  • Publication number: 20030201261
    Abstract: A glass cutting method and apparatus in which the laser beam to be irradiated onto a glass to be machined has a leading portion with a low energy density, and a trailing portion with a high energy density, thereby being capable of maximizing the thermal impact applied to the glass when the laser beam is irradiated, whereas the glass is divided into a plurality of glass portions, for which the moving speed and energy of the laser beam are controlled to meet respective thermal stress distributions at those glass portions, thereby being capable of achieving an improvement in the quality of the cut glass surface while achieving a rapid glass cutting process.
    Type: Application
    Filed: April 30, 2002
    Publication date: October 30, 2003
    Applicant: LG Electronics Inc.
    Inventors: Hyoung Shik Kang, Soon Kug Hong, Seok Chang Oh, Min Gyu Song, Kwang Yeol Baek