Patents by Inventor Hyoung-Shin Park

Hyoung-Shin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10356238
    Abstract: A cover of an electronic device is disclosed and includes a mounting part in which the electronic device is mounted, a bottom part connected to one end of the mounting part, a connecting part extending from the bottom part, and a cover part fastened to the connecting part and disposed to cover the mounting part or disposed side by side with the bottom part. The cover part has at least a portion with a specified transparency and has, on a side of the cover part, a transparent conductive pattern having at least one of an electric force and a magnetic force.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: July 16, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Ik Sang Kim, Hyoung Shin Park
  • Publication number: 20180191892
    Abstract: A cover of an electronic device is disclosed and includes a mounting part in which the electronic device is mounted, a bottom part connected to one end of the mounting part, a connecting part extending from the bottom part, and a cover part fastened to the connecting part and disposed to cover the mounting part or disposed side by side with the bottom part. The cover part has at least a portion with a specified transparency and has, on a side of the cover part, a transparent conductive pattern having at least one of an electric force and a magnetic force.
    Type: Application
    Filed: January 5, 2018
    Publication date: July 5, 2018
    Inventors: Ik Sang Kim, Hyoung Shin Park
  • Publication number: 20180017583
    Abstract: Compositions, devices and methods are described for preventing, reducing, controlling or delaying adhesion, adsorption, surface-mediated clot formation, or coagulation in a microfluidic device or chip. In one embodiment, blood (or other fluid with blood components) that contains anticoagulant is introduced into a microfluidic device comprising one or more additive channels containing one or more reagents that will re-activate the native coagulation cascade in the blood that makes contact with it “on-chip” before moving into the experimental region of the chip.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Inventors: Daniel Levner, Christopher David Hinojosa, Norman Wen, Jacob Fraser, Justin Nguyen, Riccardo Barrile, Geraldine Hamilton, Catherine Karalis, Hyoung Shin Park, Antonio Varone, Andries Van der Meer, Monica Otieno, David Conegliano
  • Publication number: 20180015455
    Abstract: Compositions, devices and methods are described for preventing, reducing, controlling or delaying adhesion, adsorption, surface-mediated clot formation, or coagulation in a microfluidic device or chip. In one embodiment, blood (or other fluid with blood components) that contains anticoagulant is introduced into a microfluidic device comprising one or more additive channels containing one or more reagents that will re-activate the native coagulation cascade in the blood that makes contact with it “on-chip” before moving into the experimental region of the chip.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Inventors: Daniel Levner, Christopher David Hinojosa, Norman Wen, Jacob Fraser, Justin Nguyen, Riccardo Barrile, Geraldine Hamilton, Catherine Karalis, Hyoung Shin Park, Antonio Varone, Andries Van der Meer, Monica Otieno, David Conegliano
  • Publication number: 20180017582
    Abstract: Compositions, devices and methods are described for preventing, reducing, controlling or delaying adhesion, adsorption, surface-mediated clot formation, or coagulation in a microfluidic device or chip. In one embodiment, blood (or other fluid with blood components) that contains anticoagulant is introduced into a microfluidic device comprising one or more additive channels containing one or more reagents that will re-activate the native coagulation cascade in the blood that makes contact with it “on-chip” before moving into the experimental region of the chip.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Inventors: Daniel Levner, Christopher David Hinojosa, Norman Wen, Jacob Fraser, Justin Nguyen, Riccardo Barrile, Geraldine Hamilton, Catherine Karalis, Hyoung Shin Park, Antonio Varone, Andries Van der Meer, Monica Otieno, David Conegliano
  • Publication number: 20180017584
    Abstract: Compositions, devices and methods are described for preventing, reducing, controlling or delaying adhesion, adsorption, surface-mediated clot formation, or coagulation in a microfluidic device or chip. In one embodiment, blood (or other fluid with blood components) that contains anticoagulant is introduced into a microfluidic device comprising one or more additive channels containing one or more reagents that will re-activate the native coagulation cascade in the blood that makes contact with it “on-chip” before moving into the experimental region of the chip.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Inventors: Daniel Levner, Christopher David Hinojosa, Noeman Wen, Jacob Fraser, Justin Nguyen, Riccardo Barrile, Geraldine Hamilton, Catherine Karalis, Hyoung Shin Park, Antonio Varone, Andries Van der Meer, Monica Otieno, David Conegliano
  • Publication number: 20180017586
    Abstract: Compositions, devices and methods are described for preventing, reducing, controlling or delaying adhesion, adsorption, surface-mediated clot formation, or coagulation in a microfluidic device or chip. In one embodiment, blood (or other fluid with blood components) that contains anticoagulant is introduced into a microfluidic device comprising one or more additive channels containing one or more reagents that will re-activate the native coagulation cascade in the blood that makes contact with it “on-chip” before moving into the experimental region of the chip.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Inventors: Daniel Levner, Christopher David Hinojosa, Norman Wen, Jacob Fraser, Justin Nguyen, Riccardo Barrile, Geraldine Hamilton, Catherine Karalis, Hyoung Shin Park, Antonio Varone, Andries Va der Meer, Monica Otieno, David Conegliano
  • Patent number: D817912
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 15, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D818462
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 22, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D854524
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D854525
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D854526
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D854527
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D855041
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 30, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D856958
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun Seo, Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D856959
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun Seo, Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D859345
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: September 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun Seo, Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D859388
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: September 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chong-Yoon Chung, Ji-Su Hwang, Hae-Sung Park, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D859389
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: September 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ik-Sang Kim, Hyoung-Shin Park, Ji-Su Hwang, Seon-Keun Park
  • Patent number: D860150
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun Seo, Hyok-Su Choi, Hyoung-Shin Park, Yun-Jin Kim