Abstract: The present invention relates to a method of manufacturing an image sensor module including attaching an image sensor on one side of a double-sided flexible printing circuit board (FPCB) provided with a window such that the image sensor module covers the window; and mounting at least one electric part on the other side of the double-sided FPCB on which the image sensor is attached.

Abstract: A image sensor module having a double-sided flexible printing circuit board (FPCB) having a window formed; an image sensor attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part attached on the other side of the double-sided FPCB having the image sensor attached thereto.

Abstract: A camera module having a housing; a lens section mounted in the housing; an IR cut filter mounted in the housing so as to cut infrared rays from the incident light passing through the lens section; and an image sensor module composed of a double-sided flexible printing circuit board (FPCB) in which a window for transmitting the incident light passing through the IR cut filter is formed, an image sensor which is attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part which is attached on the other side of the double-sided FPCB having the image sensor attached thereto, the image sensor module being coupled to the housing.